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1 Features
• AEC-Q100 qualified for automotive applications
– Temperature grade 1: –40°C to +125°C, TA
• Core
– Arm® 32-bit Cortex®-M0+ CPU, frequency up to
24MHz
• Operating characteristics
– Extended temperature: –40°C to 125°C
– Wide supply voltage range: 1.62V to 3.6V
• Memories
– Up to 16KB of flash
– 1KB of SRAM
• High-performance analog peripherals
– One analog-to-digital converter (ADC) with up
to 10 total external channels, 1.7Msps at 10 bit
or 1.5Msps at 12 bit with VDD as the voltage
reference
– Configurable 1.4V or 2.5V internal ADC voltage
reference (VREF)
– Integrated temperature sensor
– Integrated supply monitor
• Optimized low-power modes
– RUN: 87μA/MHz
– STOP: 609μA at 4MHz, 311μA at 32kHz
– STANDBY: 5μA with SRAM retention
– SHUTDOWN: 200nA
• Intelligent digital peripherals
– 1-channel DMA controller dedicated for ADC
– Three timers supporting up to 14 PWM
channels
• One 16-bit advanced timers with deadband
support up to 8 PWM channels
• One 16-bit general purpose timer with
4 capture/compares
• One 16-bit general purpose timer with
2 capture/compares
– Windowed watchdog timer
– BEEPER generating 1kHz, 2kHz, 4kHz, or
8kHz square wave to drive the external beeper
• Enhanced communication interfaces
– One UART interface supporting LIN, IrDA,
DALI, smart card, Manchester and low-power
operation in STANDBY mode
– One I2C interface supporting FM+ (1Mbps),
SMBus, PMBus, and wakeup from STOP mode
– One SPI supporting up to 12Mbps
• Clock system
– Internal 24MHz oscillator with an accuracy from
-2% to +1.2% (SYSOSC)
– Internal 32kHz low-frequency oscillator
(LFOSC)
• Data integrity
– Cyclic redundancy checker (CRC-16)
• Flexible I/O features
– Up to 18 GPIOs
– Two 5V-tolerant open-drain IOs
• Development support
– 2-pin serial wire debug (SWD)
• Package options
– 20-pin VSSOP (DGS)
– 20-pin WQFN (RUK)
– 16-pin SOT (DYY)
– 8-pin SOT (DDF)
– 8-pin WSON (DSG)
• Family members (also see Device Comparison)
– MSPM0C1104: 16KB of flash, 1KB of RAM
– MSPM0C1103: 8KB of flash, 1KB of RAM
• Development kits and software (also see Tools
and Software)
– LP-MSPM0C1104 LaunchPad™ development
kit
– MSP Software Development Kit (SDK)
2 Applications
• Automotive body electronics and Lighting
• Automotive Gateway
• Steering Wheel Systems
• Automotive Motor Control
• DC to AC Inverters
• Automotive Interior Lighting
• Door handle modules
• Kick to open modules
• Vehicle Occupancy Detection
• Seat Comfort Module
3 Description
MSPM0C110x microcontrollers (MCUs) are part of the MSP highly-integrated ultra-low-power 32-bit MCU family
based on the enhanced Arm® Cortex®-M0+ core platform operating at up to 24MHz frequency. These costoptimized
MCUs offer high-performance analog peripheral integration, support extended temperature ranges
from -40°C to 125°C, and operate with supply voltages from 1.62V to 3.6V.
The MSPM0C110x devices provide up to 16KB embedded flash program memory with 1KB SRAM. These
MCUs incorporate a high-speed on-chip oscillator with an accuracy from -2% to +1.2%, eliminating the need
for an external crystal. Additional features include a 1-channel DMA, CRC-16 accelerator, and a variety of highperformance
analog peripherals such as one 12-bit 1.5Msps ADC with VDD as the voltage reference, and an
on-chip temperature sensor. These devices also offer intelligent digital peripherals such as one 16-bit advanced
timer, two 16-bit general purpose timer, one windowed watchdog timer, and a variety of communication
peripherals including one UART, one SPI, and one I2C. These communication peripherals offer protocol support
for LIN, IrDA, DALI, Manchester, smart card, SMBus, and PMBus.
The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital
integration let customers find the MCU that meets their project needs. The architecture combined with extensive
low-power modes is optimized to achieve extended battery life in portable measurement applications.
MSPM0C110x MCUs are supported by an extensive hardware and software ecosystem with reference designs
and code examples to get the design started quickly. Development kits include a LaunchPad™ kit available for
purchase and design files for a target-socket board. TI also provides a free MSP Software Development Kit
(SDK), which is available as a component of Code Composer Studio™ IDE desktop and cloud version within
the TI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral, training with MSP
Academy, and online support through the TI E2E™ support forums.
For complete module descriptions, see the MSPM0 C-Series 24MHz Microcontrollers Technical Reference
Manual.
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
TI |
23+ |
DIP |
3000 |
全新、原装 |
|||
MIMIX |
三年内 |
1983 |
只做原装正品 |
||||
M/A-COM |
24+ |
36000 |
原装现货假一赔十 |
||||
MIMIX |
23+ |
11200 |
原厂授权一级代理、全球订货优势渠道、可提供一站式BO |
||||
M/A-COM |
24+ |
SMD |
15 |
“芯达集团”专营军工百分之百原装进口 |
|||
M/A-COM |
专业军工 |
NA |
1000 |
只做原装正品军工级部分订货 |
|||
MACOM |
20+ |
NA |
1000 |
全新原装现货,一片也是批量价。 |
|||
10 |
优势库存,全新原装 |
||||||
MACOM |
22+ |
NA |
1000 |
只做原装,价格优惠,长期供货。 |
|||
MACOM |
23+ |
NA |
25000 |
##公司主营品牌长期供应100%原装现货可含税提供技术 |
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Texas Instruments
德州仪器(Texas Instruments),简称TI,是全球领先的半导体公司,为现实世界的信号处理提供创新的数字信号处理(DSP)及模拟器件技术。除半导体业务外,还提供包括传感与控制、教育产品和数字光源处理解决方案。TI总部位于美国德克萨斯州的达拉斯,并在25多个国家设有制造、设计或销售机构。德州仪器是推动互联网时代不断发展的半导体引擎,作为实时技术的领导者,TI正在快速发展,在无线与宽带接入等大型市场及数码相机和数字音频等新兴市场方面,凭借性能卓越的半导体解决方案不断推动着互联网时代的前进步伐。TI预想未来世界的方方面面都渗透着TI产品的点点滴滴,每个电话、每次上网、拍的每张照片、听的每