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DRV8263S-Q1中文资料

厂家型号

DRV8263S-Q1

文件大小

2198.09Kbytes

页面数量

63

功能描述

DRV8263-Q1 Automotive 65V H-Bridge Driver with Integrated Current Sense and Diagnostics

数据手册

下载地址一下载地址二到原厂下载

生产厂商

TI1

DRV8263S-Q1数据手册规格书PDF详情

1 Features

• AEC-Q100 qualified for automotive applications:

– Temperature grade 1: –40°C to +125°C, TA

• Functional Safety-Capable

– Documentation available to aid functional safety

system design

• 4.5V to 65V (70V abs. max) operating range

• MOSFET ON resistance (HS + LS): 85mΩ

• Maximum output current = 29A

• Configurable control modes

– Single full-bridge, PH/EN, or PWM interface

– Two half-bridges using Independent mode

• 2 Interface options - HW or SPI

• PWM frequency operation up to 100kHz with

automatic dead time assertion

• Configurable slew rate and spread spectrum

clocking for low electromagnetic interference (EMI)

• Integrated current sense (eliminates shunt resistor)

• Proportional load current output on IPROPI

• Die temperature monitoring on IPROPI (SPI only)

• Configurable current regulation

• Protection and diagnostic features with

configurable fault reaction (latched or retry)

– Load diagnostics in both the off-state and onstate

to detect open load and short circuit

– Voltage monitoring on supply (VM)

– Over current protection

– Over temperature warning (SPI only)

– Over temperature protection

– Powered off Braking

– Fault indication on nFAULT pin

• Supports 1.8V, 3.3V, 5V logic inputs

• Low sleep current - 7μA typical at 25°C

• Device family comparison table

2 Applications

• 24V and 48V Automotive Body Systems

• Automotive brushed DC motors, Solenoids

• Door modules , mirror modules, wiper modules

and seat modules

• Trunk lift, Window lift

• Steering column, Sunroof shade

• Electric Vehicles, Truck, Bus and other

Commercial Vehicles

3 Description

The DRV8263-Q1 is a wide-voltage, high-power fully

integrated H-bridge driver for 24V and 48V automotive

applications. Designed in a BiCMOS high-power

process technology node, this device in a power

package offers excellent power handling and thermal

capability while providing compact package size,

ease of layout, EMI control, accurate current sense,

robustness, and diagnostic capability.

The device integrates a N-channel H-bridge, charge

pump, high-side current sensing with regulation,

current proportional output, and protection circuitry.

The integrated sensing uses a current mirror,

removing the need for shunt resistors, saving board

area, and reducing system cost. A low-power sleep

mode is provided to achieve low quiescent current.

The device offers voltage monitoring and load

diagnostics, as well as protection features against

overcurrent and overtemperature. Fault conditions are

indicated on the nFAULT pin. It is available in two

variants: HW interface and SPI interface. The SPI

variant offers more flexibility in device configuration

and fault observability.

更新时间:2025-10-31 14:02:00
供应商 型号 品牌 批号 封装 库存 备注 价格
80000
TI德州仪器
22+
24000
原装正品现货,实单可谈,量大价优
TI/德州仪器
24+
TSSOP-20
606
42.进口原装 假一赔十
TI(德州仪器)
24+
TSSOP20
7350
现货供应,当天可交货!免费送样,原厂技术支持!!!
TI
24+
TSSOP-20
39500
进口原装现货 支持实单价优
TI
23+
TSSOP-20
70000
专注配单,只做原装进口现货
TI
24+
TSSOP-20
9000
只做原装正品 有挂有货 假一赔十
TI
24+
TSSOP-20
10000
只有原装
Texas
25+
25000
原厂原包 深圳现货 主打品牌 假一赔百 可开票!
TI(德州仪器)
2021+
TSSOP-20
499