1 Features

Processor cores:

• Up to eight 64-bit Arm® Cortex®-A72

microprocessor subsystem at up to 2 GHz

– 2MB shared L2 cache per quad-core Cortex®-

A72 cluster

– 32KB L1 D-Cache and 48KB L1 I-Cache per

Cortex®-A72 core

• Up to Four Deep Learning Accelerators:

– Each with up to 8 Trillion Operations Per

Second (TOPS)

– Total of 32 Trillion Operations Per Second (32

TOPS)

• Dual-core Arm® Cortex®-R5F MCUs at up to 1.0

GHz in General Compute partition with FFI

– 16KB L1 D-Cache, 16KB L1 I-Cache, and 64KB

L2 TCM

• Dual-core Arm® Cortex®-R5F MCUs at up to 1.0

GHz to support Device Management

– 32K L1 D-Cache, 32K I-Cache, and 64K L2

TCM with SECDED ECC on all memories

• Up to two Vision Processing Accelerators (VPAC)

with Image Signal Processor (ISP) and multiple

vision assist accelerators

– 480 MPixel/s ISP

– Support for up to 16-bit input RAW format

– Wide Dynamic Range (WDR), Lens Distortion

Correction (LDC), Vision Imaging Subsystem

(VISS), and Multi-Scalar (MSC) support

– Output color format : 8-bits, 12-bits, and YUV

4:2:2, YUV 4:2:0, RGB, HSV/HSL

• Multimedia:

– Display subsystem supports:

• Up to 4 displays

• Up to two DSI 4L TX (up to 2.5K)

• One eDP 4L

• One DPI 24-bit RGB parallel interface

• OLDI/LVDS (4 lanes - 2x) and 24-bit RGB

parallel interface

• Safety features such as freeze frame

detection and MISR data check

– 3D Graphics Processing Unit

• IMG BXS-4-64, up to 800 MHz

• 50 GFLOPS, 4 GTexels/s

• >500 MTexels/s, >8 GFLOPs

• Supports at least 2 composition layers

• Supports up to 2048x1080 @60fps

• Supports ARGB32, RGB565 and YUV

formats

• 2D graphics capable

• OpenGL ES 3.1, Vulkan 1.2

– Three CSI2.0 4L Camera Serial interface RX

(CSI-RX) plus two CSI2.0 4L TX (CSI-TX) with

DPHY

• MIPI CSI 1.3 Compliant + MIPI-DPHY 1.2

• Support for 1,2,3, or 4 data lane mode up to

1.5Gbps

• ECC verification/correction with CRC check

+ ECC on RAM

• Virtual Channel support (up to 16)

• Ability to write stream data directly to DDR

via DMA

– Two Video Encoder/Decoder Modules

• Support for HEVC (H.265) Main profiles at

Level 5.1 High-tier

• Support for H.264 BaseLine/Main/High

Profiles at Level 5.2

• Support for up to 4K UHD resolution (3840 ×

2160) per module

• Each module supports 4K60 H.264/H.265

Encode/Decode (up to 480 MP/s)

Memory subsystem:

• Up to 8MB of on-chip L3 RAM with ECC and

coherency

– ECC error protection

– Shared coherent cache

– Supports internal DMA engine

• Up to Four External Memory Interface (EMIF)

module with ECC

– Supports LPDDR4 memory types

– Supports speeds up to 4266 MT/s

– Up to 4x32-b bus with inline ECC up to 68 GB/s

• General-Purpose Memory Controller (GPMC)

• 512KB on-chip SRAM in MAIN domain, protected

by ECC

• AEC-Q100 qualified on part number variants

ending in Q1

Device security:

• Secure boot with secure run-time support

• Customer programmable root key, up to RSA-4K

or ECC-512

• Embedded hardware security module

• Crypto hardware accelerators – PKA with ECC,

AES, SHA, RNG, DES and 3DES

ADVANCE INFORMATION

High speed serial interfaces:

• Integrated Ethernet switch supporting up to 8

external ports

– Two ports support 5Gb, 10Gb USXGMII or 5Gb

XFI

– All ports support 1Gb, 2.5Gb SGMII

– All ports can support QSGMII. A maximum of 2

QSGMII can be enabled and uses all 8 internal

lanes. 1 QSGMII interfaces uses 4 internal

lanes.

• Up to 4x2-L/2x4L PCI-Express® (PCIe) Gen3

controllers

– Gen1 (2.5GT/s), Gen2 (5.0GT/s), and Gen3

(8.0GT/s) operation with auto-negotiation

• One USB 3.0 dual-role device (DRD) subsystem

– Enhanced SuperSpeed Gen1 Port

– Supports Type-C switching

– Independently configurable as USB host, USB

peripheral, or USB DRD

Ethernet

• Two RGMII/RMII interfaces

Automotive interfaces:

• Twenty Modular Controller Area Network (MCAN)

modules with full CAN-FD support

2 Applications

• Machine Vision Camera and computers

• Smart shopping cart

• Retail automation

• Smart agriculture

• Video surveillance

• Traffic monitoring

• Autonomous Mobile Robots (AMR)

• Drone

• Industrial transport

• Industrial Human Machine Interfaces (HMI)

• Industrial PC

• Single board computers

• Patient monitoring and medical devices

Audio interfaces:

• Five Multichannel Audio Serial Port (MCASP)

modules

Flash memory interfaces:

• Embedded MultiMediaCard Interface ( eMMC™

5.1)

• One Secure Digital® 3.0 / Secure Digital Input

Output 3.0 interfaces (SD3.0/SDIO3.0

• Universal Flash Storage (UFS 2.1) interface with

two lanes

• Two independent flash interfaces configured as

– One OSPI or HyperBus™ or QSPI flash

interfaces, and

– One QSPI flash interface

System-on-Chip (SoC) architecture:

• 16-nm FinFET technology

• 31 mm × 31 mm, 0.8-mm pitch, 1414-pin FCBGA

(ALY), enables IPC class 3 PCB routing

TPS6594-Q1 Companion Power Management

ICs (PMIC):

• Functional Safety support up to ASIL-D

• Flexible mapping to support different use cases

3 Description

The AM69 scalable processor family is based on the evolutionary Jacinto™ 7 architecture, targeted at Smart

Vision Camera applications and built on extensive market knowledge accumulated over a decade of TI’s

leadership in the Vision processor market. The AM69x family is built for a broad set of cost-sensitive highperformance

compute applications in Factory Automation, Building Automation, and other markets.

The AM69 provides high performance compute technology for both traditional and deep learning algorithms

at industry leading power/performance ratios with a high level of system integration to enable scalability and

lower costs for advanced vision camera applications. Key cores include the latest Arm and GPU processors for

general compute, next generation DSP with scalar and vector cores, dedicated deep learning and traditional

algorithm accelerators, an integrated next generation imaging subsystem (ISP), video codec, and isolated MCU

island. All protected by industrial-grade safety and security hardware accelerators.

General Compute Cores and Integration Overview: Two quad-core cluster configurations (8 cores total)

of Arm® Cortex®-A72 facilitate multi-OS applications with minimal need for a software hypervisor. Up to two

Dual-core (4 cores total) Arm® Cortex®-R5F subsystems enable low-level, timing critical processing tasks to

leave the Arm® Cortex®-A72 core’s unencumbered for applications. Building on the existing world-class ISP,

TI’s 7th generation ISP includes flexibility to process a broader sensor suite, support for higher bit depth, and

features targeting analytics applications. Integrated diagnostics and safety features support operations up to

SIL-2 levels while the integrated security features protect data against modern day attacks. CSI2.0 ports enable

multi sensor inputs.

Key Performance Cores Overview: The C7000™ DSP next generation core (“C7x”) combines TI’s industry

leading DSP and EVE cores into a single higher performance core and adds floating-point vector calculation

capabilities, enabling backward compatibility for legacy code while simplifying software programming. Four

“MMA” deep learning accelerators enable performance up to 32 Trillion Operations Per Second (TOPS) [8 TOPS

per core] within the lowest power envelope in the industry, even when operating even at the worst case junction

temperatures of 105°C and 125°C. The dedicated Vision hardware accelerators provide vision pre-processing

with no impact on system performance. The C7x/MMA cores are available only for deep-learning function in the

AM69 class of processors.