位置:XI6844DBSANC > XI6844DBSANC详情

XI6844DBSANC中文资料

厂家型号

XI6844DBSANC

文件大小

1838.71Kbytes

页面数量

74

功能描述

IWRL6843/44 Single-Chip 57 to 64GHz Industrial Radar Sensor

数据手册

下载地址一下载地址二到原厂下载

简称

TI德州仪器

生产厂商

Texas Instruments

中文名称

美国德州仪器公司官网

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XI6844DBSANC数据手册规格书PDF详情

1 Features

• FMCW Transceiver

– Integrated PLL, transmitter, receiver, baseband

and ADC

– 57 - 64GHz coverage With 7GHz continuous

bandwidth

– 4 receive channels and 3 to 4 transmit channels

(IWRL6843 with 3 channels and IWRL6844

with 4 channels)

– 13dBm typical output power per Tx

– 12.5dB typical noise figure

– -89dBc/Hz typical phase noise at 1MHz

– FMCW operation

– 10MHz IF bandwidth, real-only Rx channels

– Ultra-accurate chirp engine based on fractional-

N PLL

– Per transmitter binary phase shifter

• Processing elements

– Arm® R5F® core with double precision FPU

(200MHz)

– Hardware Accelerator (HWA 1.2) for FFT, log

magnitude, and CFAR operations (200MHz)

– C66x DSP (450MHz) for post processing Radar

data

• Supports multiple low-power modes

– Idle mode and deep sleep mode

• Power management

– 1.8V and 3.3V IO support

– Built-in LDO network for enhanced PSRR

– Two power rails for 1.8V IO mode, Three power

rails for 3.3V IO mode

• FCCSP package having 17 x 17 BGA grid, 207

BGA balls; Package size: 9.1mm x 9.1mm

• Built-in calibration and self-test

– Built-in Firmware (ROM)

– Self-Contained on chip calibration system

• Host Interface

– 3 x UART

– 2 x CAN-FD

– 2 x SPI

– 1 x LIN

• LVDS for data transfer of raw ADC sample capture

• Other interfaces available to user application

– QSPI

– I2C

– JTAG

– GPIOs

– PWM Interface

– GPADCs

• Device security

– Programmable embedded hardware security

module (HSM)

– Secure authenticated and encrypted boot

support

– Customer programmable root keys, symmetric

keys (256 bit), asymmetric keys (up to RSA-4K

or ECC-512) with key revocation capability

– Cryptographic hardware accelerators: PKA with

ECC/RSA, AES (up to 256 bit), SHA (up

to 512 bit), TRNG/DRBG and SM2, SM3,

SM4(Chinese Crypto Algorithms)

– ISO21434 Cyber Security certification targeted

• Internal memory

– On-Chip RAM - 2.5MBytes (2MB for

IWRL6843)

– R5F TCMA RAM - 512KB

– R5F TCMB RAM - 256KB

– DSS L2 RAM - 384KB

– DSS L3 RAM - 512KB (available only in

IWRL6844)

– DSS L3 Shared RAM - 896KB (can be shared

with TCMs)

• Functional Safety-Compliant Targeted

– Developed for Functional Safety Applications

– Hardware integrity up to SIL 2 targeted

• Clock source

– 40.0MHz crystal for primary clock

– Supports externally driven clock (Square/Sine)

at 40.0MHz

– 32kHz internal oscillator for low power

operations

• Supports temperature operating conditions

– Junction Temperature Range: –40°C to 105°C

2 Applications

• Automated door / gate

• Motion detector

• Occupancy detection / people tracking / people

counting

• Video doorbell

• Drones

• Level Sensing

• Industrial Robots

• IP network camera

• Thermostat

• Air conditioner

• Refrigerators and freezers

• Vacuum robot

• Lawn mover

• Home theater

• PC/Notebooks

• Portable electronics

• Televisions

• Tablets

• Earphones

• Smart watches

3 Description

The IWRL684x mmWave Sensor device is TI's low power and Hardware Security Module (HSM) enabled

integrated single chip mmWave sensor based on FMCW radar technology. The device is capable of operation in

the 57GHz to 64GHz band and is designed for various industrial use cases. The device also takes advantage

of a low power architecture to enable power-constrained applications. The device is split into the following four

switchable power domains:

1. RF/Analog Sub-System: This block includes all the RF and Analog components required to transmit and

receive the RF signals.

2. Front-End Controller sub-System (FECSS): FECSS contains processor, responsible for radar front-end

configuration, control, and calibration.

3. Application Sub-System (APPSS): APPSS is where the device implements a user programmable ARM

Cortex-R5F allowing for custom control and industrial interface applications. Top Sub-System (TOPSS) and

Hardware Security Module (HSM) is part of the APPSS power domain and contains the clocking and power

management sub-blocks.

4. DSP Sub-Systems (DSS): TI's high-performance C66x DSP is integrated in it for radar signal processing.

The hardware accelerator block (HWA 1.2) supplements the DSP and ARM Cortex-R5F by offloading

common radar processing such as FFT, constant false alarm rate (CFAR), scaling, and compression.

The IWRL684x is specifically designed to be able to dynamically control the power states of the abovementioned

power domains based on application requirements. The device also features various low-power

states. These low-power states are achieved by turning off internal IP blocks of the device. IWRL684x device

also provides the option of retaining memory during these low power states to retain critical information such as

application image and RF profiles across different power modes.

A Hardware Security Module (HSM) is also provisioned in the device (available with secure part variants). The

HSM consists of a programmable Arm Cortex-M4 core and the necessary infrastructure to provide a secure zone

of operation within the device.

Additionally, the device is built with TI’s low power 45nm RF CMOS process and enables unprecedented

levels of integration in an extremely small form factor. IWRL684x is designed for low power, self-monitored,

ultra-accurate radar systems in the industrial space for applications like high density people tracking & counting,

industrial robots and drones .

更新时间:2025-6-21 9:07:00
供应商 型号 品牌 批号 封装 库存 备注 价格
TI
2025+
SOP-16
4035
全新原厂原装产品、公司现货销售
TI
24+
QFN
6
只做原装,欢迎询价,量大价优
TDK
23+
PLCC28
12379
SILICON
2023+环保现货
标准封装
2500
专注军工、汽车、医疗、工业等方案配套一站式服务
24+
N/A
51000
一级代理-主营优势-实惠价格-不悔选择
EPSON/爱普生
23+
QFN
50000
全新原装正品现货,支持订货
VICOR
23+
MODULE
11200
原厂授权一级代理、全球订货优势渠道、可提供一站式BO
YAMAHA
20+
DIP42
35830
原装优势主营型号-可开原型号增税票
YAMAHA
24+
DIP64
31
VICOR
24+
模块
6430
原装现货/欢迎来电咨询

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Texas Instruments 美国德州仪器公司

中文资料: 224173条

德州仪器(Texas Instruments),简称TI,是全球领先的半导体公司,为现实世界的信号处理提供创新的数字信号处理(DSP)及模拟器件技术。除半导体业务外,还提供包括传感与控制、教育产品和数字光源处理解决方案。TI总部位于美国德克萨斯州的达拉斯,并在25多个国家设有制造、设计或销售机构。 德州仪器(TI)是全球领先的数字信号处理与模拟技术半导体供应商,亦是推动因特网时代不断发展的半导体引擎。 ----作为实时技术的领导者,TI正在快速发展,在无线与宽带接入等大型市场及数码相机和数字音频等新兴市场方面,TI凭借性能卓越的半导体解决方案不断推动着因特网时代前进的步伐! ----TI预想未