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TPSM63603V3RDHR中文资料

厂家型号

TPSM63603V3RDHR

文件大小

3600.4Kbytes

页面数量

47

功能描述

TPSM63603 High-Density, 3-V to 36-V Input, 1-V to 16-V Output, 3-A Power Module With Enhanced HotRod??QFN Package

数据手册

原厂下载下载地址一下载地址二到原厂下载

生产厂商

TI

TPSM63603V3RDHR数据手册规格书PDF详情

1 Features

• Versatile synchronous buck DC/DC module

– Integrated MOSFETs, inductor, and controller

– Wide input voltage range of 3 V to 36 V

– Adjustable output voltage from 1 V to 16 V

– 4-mm × 6-mm × 1.8-mm overmolded package

– –40°C to 125°C junction temperature range

– Frequency adjustable from 200 kHz to 2.2 MHz

using the RT pin or an external SYNC signal

– Negative output voltage capability

• Ultra-high efficiency across the full load range

– 93 peak efficiency at 12 VIN, 5 VOUT,1 MHz

– External bias option for improved efficiency

– Shutdown quiescent current of 0.6 μA (typical)

• Ultra-low conducted and radiated EMI signatures

– Low-noise package with dual input paths and

integrated capacitors reduces switch ringing

– Spread-spectrum modulation (S suffix)

– Resistor-adjustable switch-node slew rate

– Constant-frequency FPWM mode of operation

– Meets CISPR 11 and 32 class B emissions

• Suitable for scalable power supplies

– Pin compatible with the TPSM63602 (36 V, 2 A)

• Inherent protection features for robust design

– Precision enable input and open-drain PGOOD

indicator for sequencing, control, and VIN UVLO

– Overcurrent and thermal shutdown protections

• Create a custom design using the TPSM63603

with the WEBENCH® Power Designer

2 Applications

• Test and measurement, aerospace and defense

• Factory automation and control

• Buck and inverting buck-boost power supplies

3 Description

The TPSM63603 synchronous buck power module

is a highly integrated 36-V, 3-A DC/DC solution that

combines power MOSFETs, a shielded inductor, and

passives in an Enhanced HotRod™ QFN package.

The module has pins for VIN and VOUT located at the

corners of the package for optimized input and output

capacitor layout placement. Four larger thermal pads

beneath the module enable a simple layout and easy

handling in manufacturing.

With an output voltage from 1 V to 16 V, the

TPSM63603 is designed to quickly and easily

implement a low-EMI design in a small PCB footprint.

The total solution requires as few as four external

components and eliminates the magnetics and

compensation part selection from the design process.

Although designed for small size and simplicity

in space-constrained applications, the TPSM63603

module offers many features for robust performance:

precision enable with hysteresis for adjustable inputvoltage

UVLO, resistor-programmable switch node

slew rate and spread spectrum option for improved

EMI, integrated VCC, bootstrap and input capacitors

for increased reliability and higher density, constant

switching frequency over the full load current range,

and a PGOOD indicator for sequencing, fault

protection, and output voltage monitoring.

更新时间:2025-10-15 10:47:00
供应商 型号 品牌 批号 封装 库存 备注 价格
TI
25+
B0QFN (RDH)
6000
原厂原装,价格优势
TI/德州仪器
25+
原厂封装
10280
原厂授权代理,专注军工、汽车、医疗、工业、新能源!
TI/德州仪器
25+
原厂封装
10280
TI/德州仪器
25+
原厂封装
9999
TI/德州仪器
25+
原厂封装
11000
TI/德州仪器
25+
原厂封装
10280
TI
23+
B3QFN
5000
全新原装正品现货
TI
25+
QFN30
7930
TI/德州仪器
22+
B3QFN-20
3000
TI/德州仪器
24+
B3QFN-20
1500
德泰原装/正品现货