1 Features

• AEC-Q100 qualified for automotive applications:

– Temperature grade 1: –40°C to +125°C, TA

– Junction temperature: –40°C to +150°C, TJ

• Input voltage range: 3 V to 40 V (42 V max)

• Output voltage range:

– Adjustable output: 1.2 V to 18 V

– Fixed 3.3-V and 5-V output

• Maximum output current: 500 mA

• Output voltage accuracy: ±0.85 (max)

• Low dropout voltage:

– 475 mV (max) at 450 mA (VOUT ≥ 3.3 V)

• Low quiescent current:

– 17 μA (typ) at light loads

– 5 μA (max) when disabled

• Excellent line transient response:

– ±2 VOUT deviation during cold-crank

– ±2 VOUT deviation (1-V/μs VIN slew rate)

• Power-good with programmable delay period

• Stable with a 2.2-μF or larger capacitor

• Functional Safety-Capable

– Documentation available to aid functional safety

system design

• Package options:

– 5-pin TO-252 package: 29.7°C/W RθJA

– 8-pin HSOIC-8 package with thermal pad:

41.8°C/W RθJA

2 Applications

• Reconfigurable instrument clusters

• Body control modules (BCM)

• Always-on battery-connected applications:

– Automotive gateways

– Remote keyless entries (RKE)

3 Description

The TPS7B86-Q1 is a low-dropout linear regulator

designed to connect to the battery in automotive

applications. The device has an input voltage range

extending to 40 V, which allows the device to

withstand transients (such as load dumps) that are

anticipated in automotive systems. With only a 17-

μA quiescent current at light loads, the device is an

optimal solution for powering always-on components

such as microcontrollers (MCUs) and controller area

network (CAN) transceivers in standby systems.

The device has state-of-the-art transient response

that allows the output to quickly react to changes

in load or line (for example, during cold-crank

conditions). Additionally, the device has a novel

architecture that minimizes output overshoot when

recovering from dropout. During normal operation, the

device has a tight DC accuracy of ±0.85 over line,

load, and temperature.

The power-good delay can be adjusted by external

components, allowing the delay time to be configured

to fit application-specific systems.

The device is available in thermally conductive

packaging to allow the device components to

efficiently transfer heat to the circuit board.