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TLVM13610中文资料

厂家型号

TLVM13610

文件大小

1549.91Kbytes

页面数量

35

功能描述

TLVM13610 High-Density, 3-V to 36-V Input, 1-V to 10-V Output, 8-A (10-A Peak) Synchronous Buck DC/DC Power Module with Enhanced HotRod™ QFN Package

数据手册

下载地址一下载地址二到原厂下载

简称

TI德州仪器

生产厂商

Texas Instruments

中文名称

美国德州仪器公司官网

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TLVM13610数据手册规格书PDF详情

1 Features

• Functional Safety-Capable

– Documentation available to aid functional safety

system design

• Versatile 36-VIN, 8-AOUT synchronous buck module

– Integrated MOSFETs, inductor, and controller

– Adjustable output voltage from 1 V to 10 V

– 6.5-mm × 7.5-mm × 4-mm overmolded package

– –40°C to 125°C junction temperature range

– Frequency adjustable from 200 kHz to 2.2 MHz

• Ultra-high efficiency across the full load range

– 95+ peak efficiency

– External bias option for improved efficiency

– Exposed Pad for low thermal impedance. EVM

θ JA = 18.2 °C/W.

– Shutdown quiescent current of 0.6 μA (typical)

• Ultra-low conducted and radiated EMI signatures

– Low-noise package with dual input paths and

integrated capacitors reduces switch ringing

– Resistor-adjustable switch-node slew rate

– Meets CISPR 11 and 32 Class B emissions

• Inherent protection features for robust design

– Precision enable input and open-drain PGOOD

indicator for sequencing, control, and VIN UVLO

– Overcurrent and thermal shutdown protections

• Create a custom design using the TLVM13610 with

the WEBENCH® Power Designer

2 Applications

• Test and measurement, aerospace and defense

• Factory automation and control

• Buck and inverting buck-boost power supplies

3 Description

The TLVM13610 is a highly integrated 36-V, 8-A

DC/DC solution that combines power MOSFETs, a

shielded inductor, and passives in an Enhanced

HotRod™ QFN package. The module has VIN and

VOUT pins located at the corners of the package

for optimized input and output capacitor placement.

Four larger thermal pads beneath the module enable

a simple layout and easy handling in manufacturing.

With an output voltage from 1 V to 10 V, the

TLVM13610 is designed to quickly and easily

implement a low-EMI design in a small PCB footprint.

The total solution requires as few as four external

components and eliminates the magnetics and

compensation part selection from the design process.

Although designed for small size and simplicity

in space-constrained applications, the TLVM13610

module offers many features for robust performance:

precision enable with hysteresis for adjustable

input-voltage UVLO, resistor-programmable switch

node slew rate for improved EMI. Along with

integrated VCC, bootstrap and input capacitors for

increased reliability and higher density. The module

automatically transitions between constant switching

frequency (FPWM), or variable frequency (PFM)

for higher light load efficiency. Including a PGOOD

indicator for sequencing, fault protection, and output

voltage monitoring.

更新时间:2025-6-4 16:29:00
供应商 型号 品牌 批号 封装 库存 备注 价格
TI
24+
22-PowerBQFN
8701
主营TI原装正品,欢迎选购
TI/德州仪器
25+
原厂封装
10280
原厂授权代理,专注军工、汽车、医疗、工业、新能源!
TI/德州仪器
25+
原厂封装
10280
TI(德州仪器)
2024+
N/A
500000
诚信服务,绝对原装原盘
TI
23+
NA
6800
原装正品,力挺实单
TI
22+23+
B0QFN-30
8000
新到现货,只做原装进口
TI
25+
3.6-V TO 36-V
6000
原厂原装,价格优势
TI
23+
DIP
6000
全新、原装
TI
23+
TI
3050
市场最低 原装现货 假一罚百 可开原型号
TI
24+
TI
10000
只有原装

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Texas Instruments 美国德州仪器公司

中文资料: 223873条

德州仪器(Texas Instruments),简称TI,是全球领先的半导体公司,为现实世界的信号处理提供创新的数字信号处理(DSP)及模拟器件技术。除半导体业务外,还提供包括传感与控制、教育产品和数字光源处理解决方案。TI总部位于美国德克萨斯州的达拉斯,并在25多个国家设有制造、设计或销售机构。 德州仪器(TI)是全球领先的数字信号处理与模拟技术半导体供应商,亦是推动因特网时代不断发展的半导体引擎。 ----作为实时技术的领导者,TI正在快速发展,在无线与宽带接入等大型市场及数码相机和数字音频等新兴市场方面,TI凭借性能卓越的半导体解决方案不断推动着因特网时代前进的步伐! ----TI预想未