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PISOTMP35BDFQR中文资料

厂家型号

PISOTMP35BDFQR

文件大小

1046.95Kbytes

页面数量

28

功能描述

ISOTMP35 ±1.2°C, 3-kVRMS Isolated Temperature Sensor with Analog Output with Seconds Response Time and 500 VRMS Working Voltage

数据手册

下载地址一下载地址二到原厂下载

生产厂商

TI

PISOTMP35BDFQR数据手册规格书PDF详情

1 Features

• Robust integrated isolation barrier:

– Withstand isolation voltage: 3000 VRMS

– Isolation working voltage: 500 VRMS

• Isolation barrier life: > 50 years

• Temperature sensor accuracy

– ±0.5°C typical at 25°C

– ±1.2°C maximum from 0°C to 70°C

– ±2.0°C maximum from –40°C to +150°C

• Operating supply range: 2.3 V to 5.5 V

• Positive slope sensor gain: 10 mV/°C, with 500 mV

offset at 0°C

• Fast thermal response: < 2 seconds

• Short circuit protected output

• Low power consumption: 9 μA (typical)

• DFQ (SOIC-7) package

• Safety-related certifications (planned):

– 3-kVRMS isolation for 1 minute per UL 1577

2 Applications

• AC charging (pile) station

• DC fast charging station

• Rack & server PSU with 48 V output

• Server PSU with 12 V output

• Merchant DC/DC

• Merchant telecom rectifier

• Battery backup unit

• Merchant DIN rail power supply

• AC/DC adapter PSU

3 Description

The ISOTMP35 is the industry’s first isolated

temperature sensor IC, combining an integrated

isolation barrier, up to 3000 VRMS withstand voltage,

with an analog temperature sensor featuring a 10

mV/°C slope from –40°C to +150°C. This integration

enables the sensor to be co-located with high voltage

heat source (for example: HV FETs, IGBTs, or

HV contactors) without requiring expensive isolation

circuitry. The direct contact with the high-voltage heat

source also provides greater accuracy and faster

thermal response compared approaches where the

sensor is placed further away to meet isolation

requirements.

Operating from a non-isolated 2.3-V to 5.5-V

supply, the ISOTMP35 allows easy integration

into applications where sub-regulated power is not

available on the high-voltage plane.

The integrated isolation barrier satisfies UL 1577

requirements. The surface mount package (7-pin

SOIC) provides excellent heat flow from the heat

source to the embedded thermal sensor, minimizing

thermal mass and providing more accurate heatsource

measurement. This reduces the need for timeconsuming

thermal modeling and improves system

design margin by reducing mechanical variations due

to manufacturing and assembly.

The ISOTMP35 class-AB output driver provides a

strong 500-μA maximum output to drive capacitive

loads up to 1000 pF and is designed to directly

interface with analog-to-digital converter (ADC)

sample and hold inputs.

更新时间:2026-2-15 15:13:00
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