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AM2612

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功能描述

AM261x Sitara™ Microcontrollers

数据手册

下载地址一下载地址二到原厂下载

简称

TI德州仪器

生产厂商

Texas Instruments

中文名称

美国德州仪器公司官网

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AM2612数据手册规格书PDF详情

1 Features

Processor Cores:

• Single and Dual Arm® Cortex® R5F CPU with each

core running up to 500 MHz

– 16KB I-Cache with 64-bit ECC per CPU core

– 16KB D-cache with 32-bit ECC per CPU core

– 256KB Tightly Coupled Memory (TCM) per

core, with 32-bit ECC

– Lockstep or Dual core operation supported

• Trigonometric Math Unit (TMU) for accelerating

trigonometric functions

– Up to 2 × TMU, one per R5F MCU core

Memory Subsystem:

• 1.5MB of On-Chip Shared SRAM (3 banks ×

512KB). ECC error protection for full 1.5MB

OCSRAM.

• 256KB Remote Low latency L2 cache (RL2),

software programmable, shared between all cores,

allocated from SRAM

System on Chip (SoC) Services and Architecture:

• 1 × EDMA to support data movement functions

• Device Boot supported from the following

interfaces:

– UART (Primary/Backup)

– OSPI NOR and NAND Flash (50MHz SDR and

25MHz DDR)

– USB Peripheral boot

• Interprocessor communication modules

– SPINLOCK module for synchronizing

processes running on multiple R5F CPUs and

HSM CPU

– MAILBOX functionality implemented through

CTRLMMR registers

Flash Memory Interfaces:

• 2 × Octal Serial Peripheral Interface (OSPI) at up

to 133-MHz SDR and 133-MHz DDR at 1.8V and

3.3V which can be used for

– External flash memory with full XIP (eXecute In

Place) support

– RAM expansion/FOTA

• 1 × 4-bit Multi-Media Card/Secure Digital

(MMC/SD) interface

• General-Purpose Memory Controller (GPMC)

– 16-bit parallel data bus with 22-bit address bus

and 4 chip selects

– Up to 4MB addressable memory space

– Integrated Error Location Module (ELM)

support for error checking

General Connectivity:

• 6 × Universal Asynchronous RX-TX (UART)

modules

• 4 × Serial Peripheral Interface (SPI) controllers

• 3 × Local Interconnect Network (LIN) ports

• 3 × Inter-Integrated Circuit (I2C) ports

• 2 × Modular Controller Area Network (MCAN)

modules with CAN-FD support

• 1 × Fast Serial Interface Transmitter (FSITX) at up

to 200Mbps

• 1 × Fast Serial Interface Receiver (FSIRX) at up to

200Mbps

• Up to 140 × General Purpose I/O (GPIO)

USB 2.0

• Port configurable as USB host, USB device, or

USB Dual-Role device

• USB 2.0 Host mode

– High-Speed (HS, 480Mbps)

– Full-Speed (FS, 12Mbps)

– Low-Speed (LS, 1.5Mbps)

• USB 2.0 Device mode

– High-Speed (HS, 480Mbps)

– Full-Speed (FS, 12Mbps)

Sensing and Actuation:

• Real-time Control Subsystem (CONTROLSS)

• Flexible Input/Output Crossbars (XBAR)

• 3 × 12-bit Analog to Digital Converters (ADC) with

3 MSPS maximum sampling rate

– Each ADC module with

• 7× Single ended channels OR

• 3 × Differential channels

– Highly configurable ADC digital logic

• With selectable internal or external

reference

• 4 × Post-Processing blocks for each ADC

module

• 9 × Analog Comparators with internal 12-bit DAC

reference (CMPSS-A)

• 1 × 12 bit Digital to Analog Converter (DAC)

• 10 × Enhanced High Resolution Pulse Width

Modulation (eHRPWM) modules

– Single or Dual PWM channels

– Advanced PWM Configurations

– Enhanced HRPWM extends the time resolution

of the PWM compared to EPWM

• 8 × Enhanced Capture (ECAP) modules

• 2 × Enhanced Quadrature Encoder Pulse (EQEP)

modules

• 2 × Sigma-Delta Filter Modules (SDFM)

Industrial Connectivity:

• 2× Programmable Real-time Unit – Industrial

Communication SubSystem(2× PRU-ICSS)

– 2× PRU per ICSS for a total of 4 PRU cores

– Dual core Programmable Realtime Unit

Subsystem (PRU0 / PRU1)

• Deterministic hardware

• Dynamic firmware

– 20-channel enhanced input (eGPI) per PRU

– 20-channel enhanced output (eGPO) per PRU

– Embedded Peripherals and Memory

• 1 × UART, 1x ECAP

• 1 × MDIO, 1x IEP

• 1 × 32KB Shared General Purpose RAM

• 2 × 8KB Shared Data RAM

• 1 × 12KB IRAM per PRU

• ScratchPad (SPAD), MAC/CRC

– Digital encoder and sigma-delta control loops

– The PRU-ICSS enables advanced industrial

protocols including:

• EtherCAT®, Ethernet/IP™

• PROFINET®, IO-Link®

– Dedicated Interrupt Controller (INTC)

– Dynamic CONTROLSS XBAR Integration

– Supports standard ethernet (EMAC) – up to 2

external ports

High Speed Interfaces

• Integrated Ethernet Switch(CPSW3G)

– Supporting two external ports and one internal

port with selectable MII/ RMII/ RGMII

– IEEE 1588 (2008 Annex D, Annex E, Annex F)

with 802.1AS PTP

– Clause 45 MDIO PHY management

– 512 × ALE engine based packet classifiers

– Priority flow control with up to 2KB packet size

– Four CPU hardware interrupt pacing

– IP/ UDP/ TCP checksum offload in hardware

– Supports TSN

Security:

• Hardware Security Module (HSM) with support for

Auto SHE 1.1/EVITA

• Targeted for ISO 21434 compliance

• Secure boot support

– Device Take Over Protection

– Hardware enforced root-of-trust

– Authenticated boot

– SW Anti-rollback protection

• Debug security

– Secure device debug only after proper

authentication

– Ability to disable device debug functionality

• Device ID and Key Management

– Support for OTP Memory (FUSEROM)

• Store root keys and other security fields

– Separate EFUSE controllers and FUSE ROMs

– Unique Device Public Identifiers

• Memory Protection Units (MPU)

– Dedicated Arm® MPU per Cortex®-R5F core

– System MPU - present at various interfaces in

the SoC (MPU or Firewall)

– 8 to 16 Programmable Regions

• Enable/Privilege ID

• Start/End Address

• Read/Write/Cachable

• Secure/Non-Secure

• Cryptographic acceleration

– Cryptographic cores with DMA Support

– AES - 128/192/256-bit key sizes

– SHA2 - 256/384/512-bit support

– DRBG with pseudo and true random number

generator

Functional Safety:

• Enables design of systems with functional safety

requirements

– Error Signaling Module (ESM)

– ECC or parity on calculation critical memories

– Built-In Self-Test (BIST) on-chip RAM

– Runtime internal diagnostic modules including

voltage, temperature, and clock monitoring,

windowed watchdog timers, CRC engines for

memory integrity checks

• Functional Safety-Compliant targeted [Industrial]

– Developed for functional safety applications

– Documentation to be made available to aid IEC

61508 functional safety system design

– Systematic capability up to SIL-3 targeted

– Hardware integrity up to SIL-3 targeted

– Safety-related certification

• IEC 61508 planned

• Functional Safety-Compliant targeted [Automotive]

– Developed for functional safety applications

– Documentation to be made available to aid ISO

26262 functional safety system design

– Systematic capability up to ASIL-D targeted

– Hardware integrity up to ASIL-D targeted

– Safety-related certification

• ISO 26262 planned

Technology / Package:

• AEC-Q100 qualified for automotive applications

• Package options

– Available multiple NFBGA packages (see

Section 3)

– With 0.5mm, 0.65 mm and 0.8 mm pitch

options

2 Applications

• General Purpose Safety MCU

• Two axis servo drive

• AC Inverter

• Industrial Digital Power Control

– Energy storage systems

– EV charging

– String Inverters

• Remote I/O

• Communication Module

• Automotive Digital Power Conversion/Control

– On-board Chargers, DC/DC Converters

– Battery Management Systems (BMS)

• Telematics Control Unit

3 Description

The AM261x Sitara Arm® Microcontrollers are part of Sitara AM26x real-time MCU families designed to meet

the complex real-time processing needs of next generation industrial and automotive embedded products. With

scalable Arm Cortex® R5F performance and an extensive set of peripherals, AM261x device is designed for a

broad range of applications while offering safety features and optimized peripherals for real time control.

Key features and benefits:

• Peripherals supporting system level connectivity such as Gigabit Ethernet, USB, OSPI/QSPI, CAN, UARTs,

SPI and GPIOs.

• Granular firewalls managed by Hardware Security Manager (HSM) enable developers to implement stringent

security minded system design requirements.

• Up to two R5F cores in cluster with 256KB of shared Tightly Coupled Memory (TCM) per core along with

1.5MB of shared SRAM, greatly reducing the need for external memory.

更新时间:2025-7-31 15:10:00
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Texas Instruments 美国德州仪器公司

中文资料: 224246条

德州仪器(Texas Instruments),简称TI,是全球领先的半导体公司,为现实世界的信号处理提供创新的数字信号处理(DSP)及模拟器件技术。除半导体业务外,还提供包括传感与控制、教育产品和数字光源处理解决方案。TI总部位于美国德克萨斯州的达拉斯,并在25多个国家设有制造、设计或销售机构。 德州仪器(TI)是全球领先的数字信号处理与模拟技术半导体供应商,亦是推动因特网时代不断发展的半导体引擎。 ----作为实时技术的领导者,TI正在快速发展,在无线与宽带接入等大型市场及数码相机和数字音频等新兴市场方面,TI凭借性能卓越的半导体解决方案不断推动着因特网时代前进的步伐! ----TI预想未