DESCRIPTION

The Series S134 Surface Mount Centigrid® Relay is an ultraminiature,

hermetically sealed, armature relay. The low profile height (.360”) and .100”

lead spacing make it ideal for applications where extreme packaging density

and/or close PC board spacing are required. The specially formed leads are

pre-tinned to make the relays ideal for most types of surface mount solder

reflow processes.

The basic design and internal construction are identical to the Series

134 Centigrid® relays, and are capable of meeting Teledyne Relays’

T2R® requirements. The following unique construction features and

manufacturing techniques provide overall high reliability and excellent

resistance to environmental extremes:

The S134 feature:

• All welded construction.

• High force/mass ratios for resistance to shock and vibration.

• Unique uni-frame design providing high magnetic efficiency and

mechanical rigidity.

• Advanced cleaning techniques provide maximum assurance of

internal cleanliness.

• Precious metal alloy contact material with gold plating assures excellent

high current and dry circuit switching capabilities.

The Series S134D and S134DD relays have internal discrete silicon

diodes for coil suppression and polarity reversal protection.

The sensitive surface mount Centigrid® relay has a high resistance

coil, thus requiring extremely low operating power (200 mw typical). The

advantages of reduced heat dissipation and power supply demands are

a plus