DESCRIPTION

The Series S114 Surface Mount Centigrid® Relay is an ultraminiature,

hermetically sealed, armature relay. The low profile height (.360”) and .100”

lead spacing make it ideal for applications where extreme packaging density

and/or close PC board spacing are required. The specially formed leads are

pre-tinned to make the relays ideal for most types of surface mount solder

reflow processes.

The basic design and internal construction are identical to the Series

114 Centigrid® relays, and are capable of meeting Teledyne Relays’

T2R® requirements. The following unique construction features and

manufacturing techniques provide overall high reliability and excellent

resistance to environmental extremes:

The S114 feature:

• All welded construction.

• Unique uni-frame design providing high magnetic efficiency and

mechanical rigidity.

• High force/mass ratios for resistance to shock and vibration.

• Advanced cleaning techniques provide maximum assurance of

internal cleanliness.

• Precious metal alloy contact material with gold plating assures excellent

high current and dry circuit switching capabilities.

The Series S114D relays have internal discrete silicon diodes for coil

suppression and polarity reversal protection.