型号 功能描述 生产厂家&企业 LOGO 操作
TZ0340A

SMD4.0x2.513.6MHzCrystalUnit

Features: SurfaceMountSeamWeldPackage ExcellentAging ExcellentESRperformance UltraMiniaturePackage DescriptionandApplications: Surfacemount4.0mmx2.5mmcrystalunitforuseinwirelesstelecommunicationsdevices, especiallyforaneedofultraminiaturepackageformobility.

TAI-SAW

TAI-SAW TECHNOLOGY CO., LTD.

TAI-SAW

SMDSchottkyBarrierDiode

Features IO=350mA VR=20Vto40V -Lowforwardvoltage -Designedformountingonsmallsurface. -Extremelythinpackage. -Majoritycarrierconduction. -Lead-freedevice MechanicalData -Case:0603(1608)1005(2512)standardpackage,moldedplastic. -Terminals:Goldplated

ANACHIP

易亨易亨电子股份有限公司

ANACHIP

SMDSchottkyBarrierDiode

Features IO=350mA VR=20Vto40V -Lowforwardvoltage -Designedformountingonsmallsurface. -Extremelythinpackage. -Majoritycarrierconduction. -Lead-freedevice MechanicalData -Case:0603(1608)1005(2512)standardpackage,moldedplastic. -Terminals:Goldplated

ANACHIP

易亨易亨电子股份有限公司

ANACHIP

SMDSchottkyBarrierDiode

Features IO=350mA VR=20Vto40V -Lowforwardvoltage -Designedformountingonsmallsurface. -Extremelythinpackage. -Majoritycarrierconduction. -Lead-freedevice MechanicalData -Case:0603(1608)1005(2512)standardpackage,moldedplastic. -Terminals:Goldplated

ANACHIP

易亨易亨电子股份有限公司

ANACHIP

SMDSchottkyBarrierDiode

IO=350mA VR=20to40Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Terminals:Gold

COMCHIPComchip Technology

典琦典琦科技股份有限公司

COMCHIP

NylonPush-InandThickPanelPush-InFasteners

文件:73.55 Kbytes Page:1 Pages

Heyco

Heyco

Heyco
更新时间:2024-5-29 17:06:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TAISAW
24+
SMD
880000
明嘉莱只做原装正品现货
23+
N/A
54000
一级代理放心采购
TST
23+
-
1000
华南总代

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