丝印代码：TSSOP；SN74HCS74-Q1 Automotive Schmitt-Trigger Input Dual D-Type Positive-Edge-Triggered Flip-Flops With Clear and Preset

文件：1.42704 Mbytes Page：25 Pages

ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe based

FEATURES Cu wire interconnect for low cost Standard JEDEC package outlines Multi-die production capability Turnkey test services, including strip test options ExposedPad configuration for increased thermal efficiency Up to 60% improvement in Theta JA (compared to standard TSSOP or

Silver Wirebonding

KEY FEATURES Ag-Alloy wire is softer than Cu wire resulting in lower Al-Splash and lower risk of bond pad damage Ag-Alloy wire has a wide process window that improves manufacturability for devices with fragile bond pad structures

TSSOP (Thin Shrink Small Outline Package) and MSOP (Mini Small Outline Package) are leadframe based, plastic encapsulated packages

FEATURES Cu wire interconnect for lowest cost Standard JEDEC package outlines Multi-die production capability Turnkey test services, including strip test options Available in ExposedPad configuration (Ref: DS571) Green materials are standard – Pb-free and RoHS compliant Stealth dicin

Surface Mount TSSOP Resistor Networks

Absolute tolerances to ±0.1% Tight TC Tracking to ±5ppm/°C Ratio match tolerances to ±0.05% Ultra-stable tantalum nitride resistors Standard Sn/Pb and Pb-free terminations available

丝印代码：TSSOP-16EP；LOW NOISE SINGLE PHASE FULL WAVE DIRECT PWM MOTOR DRIVER

Features • Single-Phase Full Wave BLDC Fan/Motor Drive with BTL Output (BTL Amplifier Gain = 49dB) • Low Noise Architecture • Wide Operating Voltage Range: 2.4V to 18V • PWM Speed Control with External PWM Input • DC Voltage Speed Control by Adjusting VCONT and RMI Voltage • Hall Bias Outp

丝印代码：TSSOP8；Low Power Dual Voltage Comparators

Description These devices consist of two independent low voltage comparators designed specifically to operate from a single supply over a wide range of voltages. Operation from split power supplies is also possible. These comparators also have a unique characteristic in that the input common-mod

丝印代码：TSSOP8；Low Power Dual Voltage Comparators

Description These devices consist of two independent low voltage comparators designed specifically to operate from a single supply over a wide range of voltages. Operation from split power supplies is also possible. These comparators also have a unique characteristic in that the input common-mod

丝印代码：TSSOP14；Precision rail-to-rail input / output 36 V, 6 MHz op-amps

文件：3.30826 Mbytes Page：36 Pages

丝印代码：TSSOP14；Precision rail-to-rail input / output 36 V, 6 MHz op-amps

文件：3.30826 Mbytes Page：36 Pages

丝印代码：TSSOP14；Precision rail-to-rail input / output 36 V, 6 MHz op-amps

文件：3.30826 Mbytes Page：36 Pages

丝印代码：TSSOP14；Precision rail-to-rail input / output 36 V, 6 MHz op-amps

文件：3.30826 Mbytes Page：36 Pages

TSSOP Package 14-Pin

(F) TSSOP Package 14-Pin

Surface mounted, 20 pin package

Package information - TSSOP20 Surface mounted, 20 pin package

Package Outline

Package Outline

Mechanical Dimensions

[BCD SEMI] Mechanical Dimensions

Package Outline

Package Outline

Ultra Low On-Resistance

Description HEXFET® power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the ruggedized device design, that International Rectifier is well known for, provides the designer with an ex

Package Dimensions

(F) TSSOP Package 8-Pin

14-LEAD THIN SHRINK SMALL OUTLINE

文件：58.57 Kbytes Page：4 Pages

Package Outline

文件：171.38 Kbytes Page：1 Pages

SUGGESTED PAD LAYOUT

文件：188.29 Kbytes Page：14 Pages

SUGGESTED PAD LAYOUT

文件：404.18 Kbytes Page：27 Pages

Package Outline

文件：121.21 Kbytes Page：1 Pages

TSSOP Package 14-Pin

Low-voltage 8-bit I2C-bus and SMBus low power I/O port with interrupt, weak pull-up and Agile I/O

Low-voltage 8-bit I2C-bus and SMBus low power I/O port with interrupt, weak pull-up and Agile I/O

Package Outline

文件：113.95 Kbytes Page：1 Pages

16-Pin Ceramic Case 6.4 X 5.0 mm Nominal Footprint

文件：138.72 Kbytes Page：3 Pages

Reference Pattern Layout Dimensions

文件：205.95 Kbytes Page：3 Pages

SUGGESTED PAD LAYOUT

文件：404.18 Kbytes Page：27 Pages

SUGGESTED PAD LAYOUT

文件：404.18 Kbytes Page：27 Pages

Package Outline

文件：244.54 Kbytes Page：1 Pages

SUGGESTED PAD LAYOUT

文件：404.18 Kbytes Page：27 Pages

Preliminary

文件：587.79 Kbytes Page：81 Pages

Preliminary

SUGGESTED PAD LAYOUT

文件：404.18 Kbytes Page：27 Pages

包装：散装 描述：SSOP,TSSOP BARE BRD 5PAK 开发板，套件，编程器 评估和演示板及套件

Package Outline

文件：113.91 Kbytes Page：1 Pages

Package Outline

文件：180.04 Kbytes Page：1 Pages

Socket and Footprint Card

文件：184.28 Kbytes Page：1 Pages

TSSOP-28

文件：159.51 Kbytes Page：1 Pages

16-BIT CCD/CIS ANALOG SIGNAL PROCESSOR

文件：372.07 Kbytes Page：11 Pages

Package Outline

文件：116.7 Kbytes Page：1 Pages

Package Outline

文件：124.42 Kbytes Page：1 Pages

Package Outline

文件：116.1 Kbytes Page：1 Pages

Package Outline

文件：127.48 Kbytes Page：1 Pages

Generic socket card

文件：34.2 Kbytes Page：1 Pages

Fairchild Semiconductor Product Package Material Disclosure

文件：92.94 Kbytes Page：1 Pages

Package Outline

文件：112.27 Kbytes Page：1 Pages

Tape and Reel Dimensions

文件：181.15 Kbytes Page：1 Pages

Package, Reel, Taping

文件：523.12 Kbytes Page：1 Pages

IC Packages

文件：90.78 Kbytes Page：2 Pages

LSI Assembly

文件：68.33 Kbytes Page：2 Pages

LSI Assembly

文件：68.33 Kbytes Page：2 Pages

LSI Assembly

文件：80.53 Kbytes Page：2 Pages

LSI Assembly

文件：82.22 Kbytes Page：2 Pages

3.0V to 5.5V RS-232 Driver/Receiver Pair

文件：478.5 Kbytes Page：21 Pages

3.0V to 5.5V RS-232 Driver/Receiver Pair

文件：478.5 Kbytes Page：21 Pages

3.0V to 5.5V RS-232 Driver/Receiver Pair

文件：478.5 Kbytes Page：21 Pages