ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe based

FEATURES Cu wire interconnect for low cost Standard JEDEC package outlines Multi-die production capability Turnkey test services, including strip test options ExposedPad configuration for increased thermal efficiency Up to 60% improvement in Theta JA (compared to standard TSSOP or

Silver Wirebonding

KEY FEATURES Ag-Alloy wire is softer than Cu wire resulting in lower Al-Splash and lower risk of bond pad damage Ag-Alloy wire has a wide process window that improves manufacturability for devices with fragile bond pad structures

TSSOP (Thin Shrink Small Outline Package) and MSOP (Mini Small Outline Package) are leadframe based, plastic encapsulated packages

FEATURES Cu wire interconnect for lowest cost Standard JEDEC package outlines Multi-die production capability Turnkey test services, including strip test options Available in ExposedPad configuration (Ref: DS571) Green materials are standard – Pb-free and RoHS compliant Stealth dicin

Surface Mount TSSOP Resistor Networks

Absolute tolerances to ±0.1% Tight TC Tracking to ±5ppm/°C Ratio match tolerances to ±0.05% Ultra-stable tantalum nitride resistors Standard Sn/Pb and Pb-free terminations available

TSSOP Package 14-Pin

(F) TSSOP Package 14-Pin

Surface mounted, 20 pin package

Package information - TSSOP20 Surface mounted, 20 pin package

Mechanical Dimensions

[BCD SEMI] Mechanical Dimensions

Package Outline

Package Outline

Package Outline

Package Outline

Ultra Low On-Resistance

Description HEXFET® power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the ruggedized device design, that International Rectifier is well known for, provides the designer with an ex

Package Dimensions

(F) TSSOP Package 8-Pin

14-LEAD THIN SHRINK SMALL OUTLINE

文件：58.57 Kbytes Page：4 Pages

SUGGESTED PAD LAYOUT

文件：188.29 Kbytes Page：14 Pages

SUGGESTED PAD LAYOUT

文件：404.18 Kbytes Page：27 Pages

Package Outline

文件：171.38 Kbytes Page：1 Pages

Package Outline

文件：121.21 Kbytes Page：1 Pages

TSSOP Package 14-Pin

Low-voltage 8-bit I2C-bus and SMBus low power I/O port with interrupt, weak pull-up and Agile I/O

Low-voltage 8-bit I2C-bus and SMBus low power I/O port with interrupt, weak pull-up and Agile I/O

SUGGESTED PAD LAYOUT

文件：404.18 Kbytes Page：27 Pages

Reference Pattern Layout Dimensions

文件：205.95 Kbytes Page：3 Pages

Package Outline

文件：113.95 Kbytes Page：1 Pages

SUGGESTED PAD LAYOUT

文件：404.18 Kbytes Page：27 Pages

Package Outline

文件：244.54 Kbytes Page：1 Pages

SUGGESTED PAD LAYOUT

文件：404.18 Kbytes Page：27 Pages

Preliminary

文件：587.79 Kbytes Page：81 Pages

Preliminary

SUGGESTED PAD LAYOUT

文件：404.18 Kbytes Page：27 Pages

包装：散装 描述：SSOP,TSSOP BARE BRD 5PAK 开发板，套件，编程器 评估和演示板及套件

Package Outline

文件：113.91 Kbytes Page：1 Pages

Package Outline

文件：180.04 Kbytes Page：1 Pages

Socket and Footprint Card

文件：184.28 Kbytes Page：1 Pages

TSSOP-28

文件：159.51 Kbytes Page：1 Pages

16-BIT CCD/CIS ANALOG SIGNAL PROCESSOR

文件：372.07 Kbytes Page：11 Pages

Package Outline

文件：116.7 Kbytes Page：1 Pages

Package Outline

文件：124.42 Kbytes Page：1 Pages

Package Outline

文件：116.1 Kbytes Page：1 Pages

Package Outline

文件：127.48 Kbytes Page：1 Pages

Generic socket card

文件：34.2 Kbytes Page：1 Pages

Fairchild Semiconductor Product Package Material Disclosure

文件：92.94 Kbytes Page：1 Pages

Tape and Reel Dimensions

文件：181.15 Kbytes Page：1 Pages

Package Outline

文件：112.27 Kbytes Page：1 Pages

Package, Reel, Taping

文件：523.12 Kbytes Page：1 Pages

IC Packages

文件：90.78 Kbytes Page：2 Pages

LSI Assembly

文件：68.33 Kbytes Page：2 Pages

LSI Assembly

文件：68.33 Kbytes Page：2 Pages

LSI Assembly

文件：80.53 Kbytes Page：2 Pages

LSI Assembly

文件：82.22 Kbytes Page：2 Pages

3.0V to 5.5V RS-232 Driver/Receiver Pair

文件：478.5 Kbytes Page：21 Pages

3.0V to 5.5V RS-232 Driver/Receiver Pair

文件：478.5 Kbytes Page：21 Pages

3.0V to 5.5V RS-232 Driver/Receiver Pair

文件：478.5 Kbytes Page：21 Pages

3.0V to 5.5V RS-232 Driver/Receiver Pair

文件：478.5 Kbytes Page：21 Pages

3.0V to 5.5V RS-232 Driver/Receiver Pair

文件：478.5 Kbytes Page：21 Pages

3.0V to 5.5V RS-232 Driver/Receiver Pair

文件：478.5 Kbytes Page：21 Pages