Dual Interface Buffers

Dual Interface Buffers • Dual 2-Input NAND/AND/OR/NOR • Dual 4-Input AND/NAND with Expander

Card Edge Connectors 0.100” (2.54mm) Pitch

Features: • 0.100” (2.54mm) contact spacing x 0.200” (5.08mm) row spacing • Accepts 0.062” (1.57mm) nominal thickness P.C. board • High profile insulator body, 0.600” (15.24mm) • Contact termination options include P.C. tail, wire wrap, 90 degree bends and extender board bends • Single or dua

395-ISA Series Card Edge Connector | 0.100 (2.54mm) Pitch | 0.200 (5.08mm) Row Spacing | ISA Standards | 0.600 (15.24mm) Insulator Height

Features For IBM-AT Industry Standard Architecture .100 (2.54mm) Contact Spacing x .200 (5.08mm) Row Spacing Accepts .062 (1.57mm) Nominal Thickness P.C. Board High Profile Insulator Body, .600 (15.24mm) Divided in Groups of 62 and 36 Contacts Contact Termination Options include P.C. Tail, Wi

SUBMINIATURE FUSES

文件：91.99 Kbytes Page：2 Pages

Carbon Composition Molded OD/OF Series (5 Tol.) OA Series (10)

文件：124.92 Kbytes Page：1 Pages

Voltage rating up to 1600V

文件：834.26 Kbytes Page：3 Pages