封装/外壳：0805（2012 公制） 包装：卷带（TR） 描述：RES 200K OHM 0.1% 1/8W 0805 电阻器 片式电阻器 - 表面贴装

封装/外壳：0805（2012 公制） 包装：卷带（TR） 描述：RES 200K OHM 0.1% 1/8W 0805 电阻器 片式电阻器 - 表面贴装

Lead (Pb)-Bearing Thick Film, Rectangular Chip Resistors

FEATURES • Stability R/R = 1 for 1000 h at 70 ° C • 2 mm pitch packaging option for 0603 size • Pure tin solder contacts on Ni barrier layer provides compatibility with lead (Pb)-free and lead containing soldering processes • Metal glaze on high quality ceramic • AEC-Q200 qualified • Mater

Standard Thick Film Chip Resistors

FEATURES • Stability R/R = 1 for 1000 h at 70 ° C • 2 mm pitch packaging option for 0603 size • Pure tin solder contacts on Ni barrier layer provides compatibility with lead (Pb)-free and lead containing soldering processes • Metal glaze on high quality ceramic • AEC-Q200 qualified • Mater

Standard Thick Film Chip Resistors

FEATURES • Stability R/R = 1 for 1000 h at 70 ° C • 2 mm pitch packaging option for 0603 size • Pure tin solder contacts on Ni barrier layer provides compatibility with lead (Pb)-free and lead containing soldering processes • Metal glaze on high quality ceramic • AEC-Q200 qualified • Mater

Standard Thick Film Chip Resistors

FEATURES • Stability R/R = 1 for 1000 h at 70 ° C • 2 mm pitch packaging option for 0603 size • Pure tin solder contacts on Ni barrier layer provides compatibility with lead (Pb)-free and lead containing soldering processes • Metal glaze on high quality ceramic • AEC-Q200 qualified • Mater

Standard Thick Film Chip Resistors

FEATURES • Stability R/R = 1 for 1000 h at 70 ° C • 2 mm pitch packaging option for 0603 size • Pure tin solder contacts on Ni barrier layer provides compatibility with lead (Pb)-free and lead containing soldering processes • Metal glaze on high quality ceramic • AEC-Q200 qualified • Mater