封装/外壳：0805（2012 公制） 包装：卷带（TR） 描述：RES 150 OHM 0.5% 1/8W 0805 电阻器 片式电阻器 - 表面贴装

封装/外壳：0805（2012 公制） 包装：卷带（TR） 描述：RES 150 OHM 0.5% 1/8W 0805 电阻器 片式电阻器 - 表面贴装

High Stability Thin Film Flat Chip Resistors

Standard Thick Film Chip Resistors

FEATURES ● Stability ΔR/R = 1 for 1000 h at 70 °C ● 2 mm pitch packaging option for 0603 size ● Pure tin solder contacts on Ni barrier layer    provides compatibility with lead (Pb)-free and lead    containing soldering processes ● Metal glaze on high quality ceramic ● AEC-Q200 qualified

Lead (Pb)-Bearing Thick Film, Rectangular Chip Resistors

FEATURES ● Stability ΔR/R = 1 for 1000 h at 70 °C ● 2 mm pitch packaging option for 0603 size ● Pure tin solder contacts on Ni barrier layer    provides compatibility with lead (Pb)-free and lead    containing soldering processes ● Metal glaze on high quality ceramic ● AEC-Q200 qualified

Lead (Pb)-Bearing Thick Film, Rectangular Chip Resistors

FEATURES ● Stability ΔR/R = 1 for 1000 h at 70 °C ● 2 mm pitch packaging option for 0603 size ● Pure tin solder contacts on Ni barrier layer    provides compatibility with lead (Pb)-free and lead    containing soldering processes ● Metal glaze on high quality ceramic ● AEC-Q200 qualified

Standard Thick Film Chip Resistors

FEATURES ● Stability ΔR/R = 1 for 1000 h at 70 °C ● 2 mm pitch packaging option for 0603 size ● Pure tin solder contacts on Ni barrier layer    provides compatibility with lead (Pb)-free and lead    containing soldering processes ● Metal glaze on high quality ceramic ● AEC-Q200 qualified

Lead (Pb)-Bearing Thick Film, Rectangular Chip Resistors

FEATURES ● Stability ΔR/R = 1 for 1000 h at 70 °C ● 2 mm pitch packaging option for 0603 size ● Pure tin solder contacts on Ni barrier layer    provides compatibility with lead (Pb)-free and lead    containing soldering processes ● Metal glaze on high quality ceramic ● AEC-Q200 qualified