封装/外壳：0603（1608 公制） 包装：卷带（TR） 描述：RES 820 OHM 0.5% 1/10W 0603 电阻器 片式电阻器 - 表面贴装

封装/外壳：0603（1608 公制） 包装：卷带（TR） 描述：RES 820 OHM 0.5% 1/10W 0603 电阻器 片式电阻器 - 表面贴装

High Stability Thin Film Flat Chip Resistors

EiceDRIVER™ enhanced 1EDI302xAS/1EDI303xAS evaluation board

The EiceDRIVER™ enhanced 1EDI302xAS/1EDI303xAS evaluation board is a versatile evaluation platform for the EiceDRIVER™ enhanced 1EDI302xAS/1EDI303xAS family. It features a half bridge configuration, see Figure 1. There is the option to mount either the HybridPACK™ DSC IGBT module or a discrete P

SMD POWER INDUCTORS

GENERAL SPECIFICATION : e) Resistance to solder heat : 260°C.10 secs d) Operating temp. : -40°C to +85°C c) Storage temp. : -40°C to +125°C b) Rated current : Base on temp. rise & ǻL/L0A = 10 Max. a) Temp. rise : 40°C Max.

SMD POWER INDUCTORS

SMD POWER INDUCTORS GENERAL SPECIFICATION : a) Irms : Temp. rise 40°C Max. b) Isat : ǻL/L0A=30 Max. c) Storage temp. : -40°C to +125°C d) Operating temp. : -40°C to +85°C e) Resistance to solder heat : 260°C.10 secs

Standard Thick Film Chip Resistors

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Pulse Proof, High Power Thick Film Chip Resistors

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