封装/外壳：0603（1608 公制） 包装：卷带（TR） 描述：RES 150K OHM 0.1% 1/10W 0603 电阻器 片式电阻器 - 表面贴装

封装/外壳：0603（1608 公制） 包装：卷带（TR） 描述：RES 150K OHM 0.1% 1/10W 0603 电阻器 片式电阻器 - 表面贴装

Standard Thick Film Chip Resistors

FEATURES ● Stability ΔR/R = 1 for 1000 h at 70 °C ● 2 mm pitch packaging option for 0603 size ● Pure tin solder contacts on Ni barrier layer    provides compatibility with lead (Pb)-free and lead    containing soldering processes ● Metal glaze on high quality ceramic ● AEC-Q200 qualified

Lead (Pb)-Bearing Thick Film, Rectangular Chip Resistors

FEATURES ● Stability ΔR/R = 1 for 1000 h at 70 °C ● 2 mm pitch packaging option for 0603 size ● Pure tin solder contacts on Ni barrier layer    provides compatibility with lead (Pb)-free and lead    containing soldering processes ● Metal glaze on high quality ceramic ● AEC-Q200 qualified

Lead (Pb)-Bearing Thick Film, Rectangular Chip Resistors

FEATURES ● Stability ΔR/R = 1 for 1000 h at 70 °C ● 2 mm pitch packaging option for 0603 size ● Pure tin solder contacts on Ni barrier layer    provides compatibility with lead (Pb)-free and lead    containing soldering processes ● Metal glaze on high quality ceramic ● AEC-Q200 qualified

Standard Thick Film Chip Resistors

FEATURES ● Stability ΔR/R = 1 for 1000 h at 70 °C ● 2 mm pitch packaging option for 0603 size ● Pure tin solder contacts on Ni barrier layer    provides compatibility with lead (Pb)-free and lead    containing soldering processes ● Metal glaze on high quality ceramic ● AEC-Q200 qualified

Lead (Pb)-Bearing Thick Film, Rectangular Chip Resistors

FEATURES ● Stability ΔR/R = 1 for 1000 h at 70 °C ● 2 mm pitch packaging option for 0603 size ● Pure tin solder contacts on Ni barrier layer    provides compatibility with lead (Pb)-free and lead    containing soldering processes ● Metal glaze on high quality ceramic ● AEC-Q200 qualified