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TLV350价格

参考价格：￥9.8233

型号：TLV3501AID 品牌：Texas 备注：这里有TLV350多少钱，2025年最近7天走势，今日出价，今日竞价，TLV350批发/采购报价，TLV350行情走势销售排行榜，TLV350报价。

型号	功能描述	生产厂家企业	LOGO
TLV3501	TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B	TI 德州仪器	TI
TLV3501AID	TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B	TI 德州仪器	TI
TLV3501AID.A	TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B	TI 德州仪器	TI
TLV3501AIDBVR	TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B	TI 德州仪器	TI
TLV3501AIDBVR.A	TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B	TI 德州仪器	TI
TLV3501AIDBVRG4	TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B	TI 德州仪器	TI
TLV3501AIDBVT	TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B	TI 德州仪器	TI
TLV3501AIDBVT.A	TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B	TI 德州仪器	TI
TLV3501AIDBVTG4	TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B	TI 德州仪器	TI
TLV3501AIDG4	TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B	TI 德州仪器	TI
TLV3501AIDR	TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B	TI 德州仪器	TI
TLV3501AIDR.A	TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B	TI 德州仪器	TI
TLV3501AIDRG4.A	TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B	TI 德州仪器	TI
TLV3501A-Q1	TLV3501A-Q1 4.5-ns Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• Qualified for Automotive Applications • AEC-Q100 Qualified With the Following Results: – Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature Range – Device HBM Classification Level 2 – Device CDM Classification Level C4B • High Speed: 4.5 ns • Rail-To-R	TI 德州仪器	TI
TLV3501AQDBVRQ1	TLV3501A-Q1 4.5-ns Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• Qualified for Automotive Applications • AEC-Q100 Qualified With the Following Results: – Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature Range – Device HBM Classification Level 2 – Device CDM Classification Level C4B • High Speed: 4.5 ns • Rail-To-R	TI 德州仪器	TI
TLV3501AQDBVRQ1.A	TLV3501A-Q1 4.5-ns Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• Qualified for Automotive Applications • AEC-Q100 Qualified With the Following Results: – Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature Range – Device HBM Classification Level 2 – Device CDM Classification Level C4B • High Speed: 4.5 ns • Rail-To-R	TI 德州仪器	TI
TLV3501AQDBVRQ1G4	TLV3501A-Q1 4.5-ns Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• Qualified for Automotive Applications • AEC-Q100 Qualified With the Following Results: – Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature Range – Device HBM Classification Level 2 – Device CDM Classification Level C4B • High Speed: 4.5 ns • Rail-To-R	TI 德州仪器	TI
TLV3501AQDBVRQ1G4.A	TLV3501A-Q1 4.5-ns Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• Qualified for Automotive Applications • AEC-Q100 Qualified With the Following Results: – Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature Range – Device HBM Classification Level 2 – Device CDM Classification Level C4B • High Speed: 4.5 ns • Rail-To-R	TI 德州仪器	TI
TLV3501AZQDBVRQ1	TLV3501A-Q1 4.5-ns Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• Qualified for Automotive Applications • AEC-Q100 Qualified With the Following Results: – Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature Range – Device HBM Classification Level 2 – Device CDM Classification Level C4B • High Speed: 4.5 ns • Rail-To-R	TI 德州仪器	TI
TLV3501AZQDBVRQ1.A	TLV3501A-Q1 4.5-ns Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• Qualified for Automotive Applications • AEC-Q100 Qualified With the Following Results: – Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature Range – Device HBM Classification Level 2 – Device CDM Classification Level C4B • High Speed: 4.5 ns • Rail-To-R	TI 德州仪器	TI
TLV3502	TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B	TI 德州仪器	TI
TLV3502	TLV3502-Q1, 4.5-ns Rail-to-Rail High-Speed Comparator 1 Features 1• Qualified for Automotive Applications • AEC-Q100 Qualified With the Following Results: – Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature Range – Device HBM ESD Classification Level 2 – Device CDM ESD Classification Level C4B • High Speed: 4.5 ns • R	TI 德州仪器	TI
TLV3502AID	TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B	TI 德州仪器	TI
TLV3502AID.A	TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B	TI 德州仪器	TI
TLV3502AIDCNR	TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B	TI 德州仪器	TI
TLV3502AIDCNR.A	TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B	TI 德州仪器	TI
TLV3502AIDCNRG4	TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B	TI 德州仪器	TI
TLV3502AIDCNT	TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B	TI 德州仪器	TI
TLV3502AIDCNT.A	TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B	TI 德州仪器	TI
TLV3502AIDCNTG4	TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B	TI 德州仪器	TI
TLV3502AIDG4	TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B	TI 德州仪器	TI
TLV3502AIDR	TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B	TI 德州仪器	TI
TLV3502AIDR.A	TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B	TI 德州仪器	TI
TLV3502AIDRG4.A	TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B	TI 德州仪器	TI
TLV3502AQDCNRQ1	TLV3502-Q1, 4.5-ns Rail-to-Rail High-Speed Comparator 1 Features 1• Qualified for Automotive Applications • AEC-Q100 Qualified With the Following Results: – Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature Range – Device HBM ESD Classification Level 2 – Device CDM ESD Classification Level C4B • High Speed: 4.5 ns • R	TI 德州仪器	TI
TLV3502AQDCNRQ1.A	TLV3502-Q1, 4.5-ns Rail-to-Rail High-Speed Comparator 1 Features 1• Qualified for Automotive Applications • AEC-Q100 Qualified With the Following Results: – Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature Range – Device HBM ESD Classification Level 2 – Device CDM ESD Classification Level C4B • High Speed: 4.5 ns • R	TI 德州仪器	TI
TLV3502-Q1	TLV3502-Q1, 4.5-ns Rail-to-Rail High-Speed Comparator 1 Features 1• Qualified for Automotive Applications • AEC-Q100 Qualified With the Following Results: – Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature Range – Device HBM ESD Classification Level 2 – Device CDM ESD Classification Level C4B • High Speed: 4.5 ns • R	TI 德州仪器	TI
TLV3502-Q1	TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B	TI 德州仪器	TI
TLV350X	TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages 1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B	TI 德州仪器	TI
TLV3501	0.9-V to 6.5-V, Nanopower Comparator 文件：3.09108 Mbytes Page：24 Pages	TI 德州仪器	TI
TLV3501	4.5ns Rail-to-Rail, High-Speed Comparator in Microsize Packages 文件：818.28 Kbytes Page：21 Pages	TI 德州仪器	TI
TLV3501	2.2-V to 36-V, microPower Comparator 文件：1.6897 Mbytes Page：18 Pages	TI 德州仪器	TI
TLV3501	4.5ns Rail-to-Rail, High-Speed Comparator in Microsize Packages 文件：780.18 Kbytes Page：21 Pages	TI 德州仪器	TI
TLV3501	4.5ns Rail-to-Rail, High-Speed Comparator in Microsize Packages 文件：763.14 Kbytes Page：21 Pages	TI 德州仪器	TI
TLV3501	4.5ns Rail-to-Rail, High-Speed Comparator in Microsize Packages 文件：381.62 Kbytes Page：15 Pages	TI 德州仪器	TI
TLV3501AID	4.5ns Rail-to-Rail, High-Speed Comparator in Microsize Packages 文件：381.62 Kbytes Page：15 Pages	TI 德州仪器	TI
TLV3501AID	4.5ns Rail-to-Rail, High-Speed Comparator in Microsize Packages 文件：763.14 Kbytes Page：21 Pages	TI 德州仪器	TI
TLV3501AIDBVR	4.5ns Rail-to-Rail, High-Speed Comparator in Microsize Packages 文件：763.14 Kbytes Page：21 Pages	TI 德州仪器	TI
TLV3501AIDBVR	4.5ns Rail-to-Rail, High-Speed Comparator in Microsize Packages 文件：780.18 Kbytes Page：21 Pages	TI 德州仪器	TI
TLV3501AIDBVR	4.5ns Rail-to-Rail, High-Speed Comparator in Microsize Packages 文件：381.62 Kbytes Page：15 Pages	TI 德州仪器	TI
TLV3501AIDBVRG4	4.5ns Rail-to-Rail, High-Speed Comparator in Microsize Packages 文件：381.62 Kbytes Page：15 Pages	TI 德州仪器	TI
TLV3501AIDBVRG4	4.5ns Rail-to-Rail, High-Speed Comparator in Microsize Packages 文件：763.14 Kbytes Page：21 Pages	TI 德州仪器	TI
TLV3501AIDBVT	4.5ns Rail-to-Rail, High-Speed Comparator in Microsize Packages 文件：780.18 Kbytes Page：21 Pages	TI 德州仪器	TI
TLV3501AIDBVT	4.5ns Rail-to-Rail, High-Speed Comparator in Microsize Packages 文件：381.62 Kbytes Page：15 Pages	TI 德州仪器	TI
TLV3501AIDBVT	4.5ns Rail-to-Rail, High-Speed Comparator in Microsize Packages 文件：763.14 Kbytes Page：21 Pages	TI 德州仪器	TI
TLV3501AIDBVTG4	4.5ns Rail-to-Rail, High-Speed Comparator in Microsize Packages 文件：763.14 Kbytes Page：21 Pages	TI 德州仪器	TI
TLV3501AIDG4	4.5ns Rail-to-Rail, High-Speed Comparator in Microsize Packages 文件：763.14 Kbytes Page：21 Pages	TI 德州仪器	TI
TLV3501AIDG4	4.5ns Rail-to-Rail, High-Speed Comparator in Microsize Packages 文件：381.62 Kbytes Page：15 Pages	TI 德州仪器	TI
TLV3501AIDR	4.5ns Rail-to-Rail, High-Speed Comparator in Microsize Packages 文件：381.62 Kbytes Page：15 Pages	TI 德州仪器	TI
TLV3501AIDR	4.5ns Rail-to-Rail, High-Speed Comparator in Microsize Packages 文件：763.14 Kbytes Page：21 Pages	TI 德州仪器	TI

TLV350产品属性

类型
描述
型号
TLV350
功能描述
校验器 IC 4.5ns Rail-to-Rail High Speed
RoHS
否
制造商
STMicroelectronics
输出类型
Push-Pull
电源电压-最大
5.5 V
电源电压-最小
1.1 V
补偿电压（最大值）
6 mV
电源电流（最大值）
1350 nA
最大工作温度
+ 125 C
安装风格
SMD/SMT
封装/箱体
SC-70-5
封装
Reel

TLV350供应商更多...

更新时间：2025-12-28 18:00:00

IC供应商	芯片型号	品牌	批号	封装	库存	备注	价格
深圳市冠亿通科技有限公司	TLV3501AIDR	TI/德州仪器	25+		25000	原厂原包深圳现货主打品牌假一赔百可开票!	询价
芯灿微（深圳）科技有限公司	TLV3501AIDR	TI/德州仪器	22+	SOP-8_150mil	500000	原装现货支持实单价优/含税	询价
深圳市明嘉莱科技有限公司	TLV3501AIDR	TEXAS INSTRUMENTS	25+	SMD	918000	明嘉莱只做原装正品现货	询价
深圳市得捷芯城科技有限公司	TLV3501AIDR	TI(德州仪器)	24+	SOP-8_150mil	8848	原厂可订货,技术支持,直接渠道。可签保供合同	询价
深圳市高捷芯城科技有限公司	TLV3501AIDR	TI(德州仪器)	24+	SOP	14548	原厂可订货,技术支持,直接渠道。可签保供合同	询价
深圳市华斯顿科技有限公司	TLV3501AIDR	TI	25+23+		23692	绝对原装正品全新进口深圳现货	询价
深圳市坤融电子科技有限公司	TLV3501AIDRG4	TI/德州仪器	2025+	SOP8	5000	原装进口,免费送样品!	询价
深圳市百诺芯科技有限公司	TLV3501AIDR	TI/德州仪器	23+	SOIC8	18204	原装正品代理渠道价格优势	询价
齐创科技(上海,北京,青岛)有限公司	TLV3501AIDR	TI	23+	SOP8	8000	原装正品,假一罚十	询价
深圳市一线半导体有限公司	TLV3501AIDR	TI	24+	SOP8	5530		询价

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TLV340x是TI的第一个纳米功率比较器系列，每个通道的供电电流只有470毫安，这使得该设备非常适合电池供电和无线手机应用。
2021-7-6
TLV3401单路毫微功耗高电压比较器
TLV340x是TI的第一个纳米功率比较器系列，每个通道的供电电流只有470毫安，这使得该设备非常适合电池供电和无线手机应用。
2021-7-6
TLV3501推挽式输出比较器
TLV350x系列推挽式输出比较器具有快速的4.5ns传输延迟和从2.7V到5.5V的操作。超出rails输入共模范围使其成为低压应用的理想选择。轨到轨输出直接驱动CMOS或TTL逻辑。
2021-6-23
TLV3501A-Q1轨对轨高速比较器
TLV3501A-Q1推挽输出比较器具有快速4.5 ns传播延迟和工作电压从2.7 V到5.5 V。输入电压支持超出使设备成为低压应用。轨对轨直接输出驱动CMOS或TTL逻辑。快速延迟和宽共模范围也使TLV3501A-Q1 通过频率降低电磁干扰的理想设备通过降低EMI
2021-6-22

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