System Basis Chip

文件：5.12789 Mbytes Page：162 Pages

TLE9261BQX 是一款采用裸露焊盘 VQFN-48（7mm x 7mm）功率封装的单片集成电路，具有 LTI 功能，支持 AOI

TLE9261-3BQX V33 属于英飞凌的中端+ SBC 系列，专为各种 CAN 汽车应用而设计

System Basis Chip

文件：5.18662 Mbytes Page：163 Pages

封装/外壳：48-VFQFN 裸露焊盘 包装：托盘 描述：IC INTERFACE SPECIALIZED 48VQFN 集成电路（IC） 专用

封装/外壳：48-VFQFN 裸露焊盘 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：IC INTERFACE SPECIALIZED 48VQFN 集成电路（IC） 专用

Electronic, 12 C #20 Str TC, PVC Ins, OA TC Brd, PVC Jkt, CMG

Product Description Electronic, 12 Conductor 20AWG (7x28) Tinned Copper, PVC Insulation, Overall Tinned Copper Braid(85) Shield, PVC Outer Jacket, CMG

BD9261EFV・BD9261FP Technical Note

1.1 Features 1. 4ch_LED constant current driver is equipped. 2. Maximum LED output current: 200 mA(peak Current:400mA MAX) 3. External setting of LED voltage by LED_LV terminal is enabled. 4. DC/DC converter is equipped. 5. Both PWM and analog dimming are enabled. 6. LED abnormality detectio

BD9261EFV・BD9261FP Technical Note

1.1 Features 1. 4ch_LED constant current driver is equipped. 2. Maximum LED output current: 200 mA(peak Current:400mA MAX) 3. External setting of LED voltage by LED_LV terminal is enabled. 4. DC/DC converter is equipped. 5. Both PWM and analog dimming are enabled. 6. LED abnormality detectio

16-Bit, 10 MHz Bandwidth, 30 MSPS to 160 MSPS Continuous Time Sigma-Delta ADC

文件：577.64 Kbytes Page：29 Pages

64K(128K, 256K, 512K) x 72 SRAM Module

文件：207.37 Kbytes Page：12 Pages