DUAL INTERFACE BUFFERS / DUAL 2-INPUT NAND/AND/OR/NOR / DUAL 4-INPUT AND/NAND WITH EXPANDER

Coming Soon. If you have some information on related parts, please share useful information by adding links below.

DUAL INTERFACE BUFFERS / DUAL 2-INPUT NAND/AND/OR/NOR / DUAL 4-INPUT AND/NAND WITH EXPANDER

Coming Soon. If you have some information on related parts, please share useful information by adding links below.

DUAL INTERFACE BUFFERS / DUAL 2-INPUT NAND/AND/OR/NOR / DUAL 4-INPUT AND/NAND WITH EXPANDER

Coming Soon. If you have some information on related parts, please share useful information by adding links below.

1 W Single-Bias GaAs Power PHEMTs prematched for 5~8 GHz

文件：83.2 Kbytes Page：2 Pages

Hybrid IC

Hybrid IC

1W Single-Bias and Prematched GaAs Power PHEMTs using SMT package

文件：91.98 Kbytes Page：2 Pages

1W Packaged Single-Bias PHEMT GaAs Power FETs

文件：193.77 Kbytes Page：3 Pages

Hybrid IC

Card Edge Connectors 0.100” (2.54mm) Pitch

Features: • 0.100” (2.54mm) contact spacing x 0.200” (5.08mm) row spacing • Accepts 0.062” (1.57mm) nominal thickness P.C. board • High profile insulator body, 0.600” (15.24mm) • Contact termination options include P.C. tail, wire wrap, 90 degree bends and extender board bends • Single or dua

395-ISA Series Card Edge Connector | 0.100 (2.54mm) Pitch | 0.200 (5.08mm) Row Spacing | ISA Standards | 0.600 (15.24mm) Insulator Height

Features For IBM-AT Industry Standard Architecture .100 (2.54mm) Contact Spacing x .200 (5.08mm) Row Spacing Accepts .062 (1.57mm) Nominal Thickness P.C. Board High Profile Insulator Body, .600 (15.24mm) Divided in Groups of 62 and 36 Contacts Contact Termination Options include P.C. Tail, Wi

SUBMINIATURE FUSES

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Carbon Composition Molded OD/OF Series (5 Tol.) OA Series (10)

文件：124.92 Kbytes Page：1 Pages

Voltage rating up to 1600V

文件：834.26 Kbytes Page：3 Pages