DIGITALAUDIOPROCESSOR

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封装/外壳：28-TSSOP（0.173"，4.40mm 宽） 功能：音频信号处理器 包装：管件 描述：IC AUDIO SIGNAL PROCESSR 28TSSOP 集成电路（IC） 音频专用

封装/外壳：28-TSSOP（0.173"，4.40mm 宽） 功能：音频信号处理器 包装：管件 描述：IC AUDIO SIGNAL PROCESSR 28TSSOP 集成电路（IC） 音频专用

MICROWAVECWBIPOLAR

[ACRIANINC] GENERALDESCRIPTION The3001isacommonbasetransistorcapableofproviding1WattsofCWRFoutputpowerat3000MHz.Thishermeticallysealedtransistorisspecificallydesignedtelemetryandtelecommunicationsapplications.Itusesgoldmetalizationanddiffusedballastingtop

KKMaxi-3.96mm&5.08mmModularInterconnectionSystem

KEYFEATURES ■Availableon3.96mmand5.08mmcenterspacings ■Polarisationviainsertablekeysandpegs ■Allowsconnectionsanywhereontheboard ■Doublecantileverstyleterminal ■Selectivegoldplatingoptions ■End-to-endstackingcapabilities ■Lockingrampforimprovedmatedret

1Watt-28Volts,ClassCMicrowave3000MHz

GENERALDESCRIPTION The3001isaCOMMONBASEtransistorcapableofproviding1WattsClassC,RFoutputpowerat3000MHz.Goldmetalizationanddiffusedballastingareusedtoprovidehighreliabilityandsupremeruggedness.ThetransistorusesafullyhermeticHighTemperatureSolderSealedpa

RFManual16thedition

Generaldescription 10WplasticLDMOSpowertransistorforbasestationapplicationsatfrequenciesfrom700MHzto2700MHz. Featuresandbenefits ■Highefficiency ■Excellentruggedness ■Designedforbroadbandoperation ■Excellentthermalstability ■Highpowergain ■IntegratedESDp

KNOB

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