Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

3V AM/FM IF IC WITH POWER AMPLIFIER

文件：1.06731 Mbytes Page：14 Pages

3V AM/FM IF IC WITH POWER AMPLIFIER

3V AM/FM IF IC WITH POWER AMPLIFIER

文件：1.06731 Mbytes Page：14 Pages

3V AM/FM IF IC WITH POWER AMPLIFIER

文件：1.06731 Mbytes Page：14 Pages

Vertical Driver LSI for Video Camera CCD Area Image Sensor

Overview The MN3111H is a vertical driver LSI for a two-dimensional interline CCD image sensor. It features a built-in power supply circuit that, in conjunction with such external components as four booster capacitors, six voltage stabilization capacitors, eight Schottky barrier diodes, and two Z

ULTRAFAST RECTIFIER 8.0 AMPERES 1000 VOLTS

SWITCHMODE™ Ultrafast E Series Power Rectifier Plastic TO–220 Package Features mesa epitaxial construction with glass passivation. Ideally suited high frequency switching power supplies; free wheeling diodes; polarity protection diodes; and inverters. • 20 mjoules Avalanche Energy

SCHOTTKY BARRIER RECTIFIERS(VOLTAGE 20 to 100 Volts CURRENT - 8 Ampere)

VOLTAGE 20 to 150 Volts CURRENT 8 Amperes FEATURES • Plastic package has Underwriters Laboratory Flammability Classification 94V-O utilizing Flame Retardant Epoxy Molding Compound. • Exceeds environmental standards of MILS-19500/228 • Low power loss, high efficiency. • Low forwrd voltge, high

SILICON UP/DOWN CONVERTERS IC FOR 800 MHz to 900 MHz MOBILE COMMUNICATIONS

DESCRIPTION µPC8100GR is a silicon monolithic integrated circuit designed as up/down converters for 800 MHz to 900 MHz mobile communications, mainly CT2. This IC consists of upconverter and downconverter, which are packaged in 20 pin SSOP. Quadrature modulator IC (µPC8101GR) is also available as

SILICON UP/DOWN CONVERTERS IC FOR 800 MHz to 900 MHz MOBILE COMMUNICATIONS

DESCRIPTION µPC8100GR is a silicon monolithic integrated circuit designed as up/down converters for 800 MHz to 900 MHz mobile communications, mainly CT2. This IC consists of upconverter and downconverter, which are packaged in 20 pin SSOP. Quadrature modulator IC (µPC8101GR) is also available as