CompactPCI Carrier for 2 IndustryPacks

Application Information The TCP211 is a standard 3U CompactPCI carrier for up to two single-size or one double-size IndustryPack (IP) modules used to build modular, flexible and cost effective I/O solutions for applications in process control, medical systems, telecommunication and traffic contro

PCI Carrier for 2 Industry Packs®

Application Information The TPCI100 is a standard 33 MHz 32 bit PCI Carrier for up to two single-size or one double-size IndustryPack (IP) modules allowing to build up modular, flexible and cost effective I/O solutions for all kinds of applications like process control, medical systems, telecommu

PCI Carrier for 4 Industry Packs®

Application Information The TPCI200 is a standard 33 MHz 32 bit PCI Carrier for up to four single-size or two double-size IndustryPack (IP) modules used to build modular, flexible and cost effective I/O solutions for applications in process control, medical systems, telecommunication and traffic

VMEbus Carrier for 4 IndustryPacks

Application Information The TVME200 is 6U VMEbus Carrier for up to 4 singlesize or 2 double-size IndustryPack (IP) modules used to build modular, flexible and cost effective I/O solutions for applications in process control, medical systems, telecommunication and traffic control. A set of 16

VMEbus Carrier for 4 IndustryPacks

Application Information The TVME202 is 6U VMEbus Carrier for up to 4 singlesize or 2 double-size IndustryPack (IP) modules provides modular, flexible and cost effective I/O solutions for applications in process control, medical systems, telecommunication and traffic control. A set of 16-posi

VMEbus Carrier for 2 IndustryPacks

The TVME210 is a 3U VMEbus Carrier for up to two single-size or one double-size IndustryPack (IP) modules allowing to build up modular, flexible and cost effective I/O solutions for all kinds of applications like process control, medical systems, telecommunication and traffic control. Two 50

VMEbus Carrier for 2 IndustryPacks

Application Information The TVME211 is a 3U VMEbus Carrier for up to two single- size or one double-size IndustryPack (IP) modules allowing to build up modular, flexible and cost effective I/O solutions for all kinds of applications like process control, medical systems, telecommunication and

Power Chip Resistors Thick Film on Alumina Substrate

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Power Chip짰 Thick Film on Alumina Substrate

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High Power Density

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Cable Kit for Modules with 50 pin Ribbon Cable Connector

Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

Power Chip Resistors Thick Film on Alumina Substrate

文件：170.81 Kbytes Page：1 Pages

High Power Density

文件：333.97 Kbytes Page：2 Pages

封装/外壳：径向 包装：散装 描述：RES 100K OHM 5% 5W POWERCHIP 电阻器 通孔式电阻器

封装/外壳：径向 包装：散装 描述：RES 100 OHM 5% 5W POWERCHIP 电阻器 通孔式电阻器

插件电阻

插件电阻

Power Chip Resistors Thick Film on Alumina Substrate

文件：170.81 Kbytes Page：1 Pages

Precision Vise Combinations

Model 201 Features: > The easy-to-use single knob controls head movement through 3-planes: 210° Tilt, 360° Turn & 360° Rotation > Fine/coarse adjusting knob controls jaw pressure for delicate work > Grooved jaws are excellent for holding small objects and are made of reinforced thermal compos

Card Edge Connectors 0.156” (3.96mm) Pitch

Features: • 0.156” (3.96mm) contact spacing x 0.140” (3.56mm) row spacing • Accepts 0.062” (1.57mm) nominal thickness P.C. board • Low profile insulator body, 0.470” (11.94mm) • Contact termination options include P.C. tail, wire hole, extender board bends • Dual row configuration • Large va

305 Series Can Tumblers

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PICO 305 Series Fuses - 277V UL913 Intrinsically Safe Fuse

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SINGLE CHANNEL COAXIAL, N & TNC CONNECTORS

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