Power Chip Resistors Thick Film on Alumina Substrate

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High Power Density

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Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

封装/外壳：径向 包装：散装 描述：RES 100 OHM 5% 3W POWERCHIP 电阻器 通孔式电阻器

封装/外壳：径向 包装：散装 描述：RES 10K OHM 5% 3W POWERCHIP 电阻器 通孔式电阻器

插件电阻

插件电阻

插件电阻

IP 68 Military Rugged USB 3. Gen1 advanced featured Smart HUB

PRODUCT DESCRIPTION The MILTECH™ 303 USB hub enables the connectivity and communication between multiple USB devices in weight and space-constrained fixed-wing/rotor aircraft, soldier carry and harsh environments. This MIL-STD, rugged USB hub features 5 USB 3. ports, a dedicated External Pow

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