位置:TA303PA4K50JE > TA303PA4K50JE详情

TA303PA4K50JE中文资料

厂家型号

TA303PA4K50JE

文件大小

129.94Kbytes

页面数量

1

功能描述

Power Chip Thick Film on Alumina Substrate

数据手册

下载地址一下载地址二到原厂下载

生产厂商

OHMITE

TA303PA4K50JE数据手册规格书PDF详情

Power Chip® Thick Film on Alumina Substrate

Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maximized by the planar package configuration which dissipates heat well above board level.

Ohmite’s power chip resis tors have a 125 higher operating temperature range than competitive product of similar design. High temperature solder and in-process plating keep terminations secure under self-heating effects by preventing re-flow from full power operation.

Flexible packaging schemes make these resistors ideal for power supplies, audio amplifiers, video fly-back, and other power control applications.

FeATureS

• High-Temp Terminal Construction

• Wide Resistance Range

• Low Inductance (50nH-100nH)

• High Power Density

• Easy to install. PC-mountable

TA303PA4K50JE产品属性

  • 类型

    描述

  • 型号

    TA303PA4K50JE

  • 制造商

    OHMITE

  • 制造商全称

    Ohmite Mfg. Co.

  • 功能描述

    Power Chip Thick Film on Alumina Substrate

更新时间:2025-11-19 13:31:00
供应商 型号 品牌 批号 封装 库存 备注 价格
TOSHIBA
24+
SO-8
626
8243
原装现货
24+
N/A
56000
一级代理-主营优势-实惠价格-不悔选择
TOSHIBA/东芝
23+
DIP-8
11200
原厂授权一级代理、全球订货优势渠道、可提供一站式BO
金升阳
900
MORNSUN
2450+
DIP
6540
只做原厂原装正品终端客户免费申请样品