型号 功能描述 生产厂家 企业 LOGO 操作
TA3025PA4K50JE

Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

OHMITE

Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

OHMITE

Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

OHMITE

TA3025PA4K50JE产品属性

  • 类型

    描述

  • 型号

    TA3025PA4K50JE

  • 制造商

    OHMITE

  • 制造商全称

    Ohmite Mfg. Co.

  • 功能描述

    Power Chip Thick Film on Alumina Substrate

更新时间:2025-10-4 15:30:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TOSHIBA
24+
SO-8
626
金升阳
900
OHMITE
23+
NA
11200
原厂授权一级代理、全球订货优势渠道、可提供一站式BO
24+
N/A
56000
一级代理-主营优势-实惠价格-不悔选择
MORNSUN
2450+
DIP
6540
只做原厂原装正品终端客户免费申请样品
25+
SO-8
7500
十年品牌!原装现货!!!
8243
原装现货

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