Power Chip Resistors Thick Film on Alumina Substrate

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High Power Density

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Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

封装/外壳：径向 包装：散装 描述：RES 100 OHM 5% 3W POWERCHIP 电阻器 通孔式电阻器

封装/外壳：径向 包装：散装 描述：RES 10K OHM 5% 3W POWERCHIP 电阻器 通孔式电阻器

插件电阻

插件电阻

插件电阻

102/103, 202/203, 302/303 Flanged Diaphragm Seal

FEATURES 316L stainless steel top housing (standard) A thin PTFE gasket between the diaphragm/bottom housing ensures a leak-tight, corrosion resistant seal Continuous duty design prevents loss of process fluid if pressure instrument is removed or fails Modular design allows for a suitable

Surface Mount Fuses - Subminiature Surface Mount & Dip Types

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M12-A Female 5 Pin Field Attachable

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BLACK COLOR NI/CU POLYESTER TAFFETA FABRIC-OVER-FOAM

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Masking Tape

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