Key Applications

Software-defined Storage, In-Memory Computing, Scale Out All-Flash NVMe

Storage, Data Intensive HPC, Private & Hybrid Cloud, NVMe Over Fabrics

Solution, AI/Deep Learning Training and Inference,

Key Features

Dual Socket E2 (LGA-4710) Intel® Xeon® 6 6700 series processors

Support CPU TDP up to 350W with air cooling;

Up to 32 DIMMs supporting up to 8TB DDR5-6400 in 2DPC;

Flexible networking with up to 2 OCP 3.0 compatible AIOM slots;

Up to 2 PCIe 5.0 x16 FHHL + 1 PCIe 5.0 x8 FHHL + 2 PCIe 5.0 x16 AIOM slots;

Up to 32 front hot-swap E3.S 1T NVMe drive bays

Up to 8 CXL 2.0 x8 Type 3 devices;

Up to 2 double-width GPUs (Max TDP 300W);