Key Applications

Artificial Intelligence (AI), High Availability Storage, NVMe Over Fabrics

Solution,

Key Features

Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports

the following:;

Single Socket E (LGA-4677) 5th/4th Generation Intel® Xeon® Scalable

processor. Up to 350W TDP.;

2 PCIe 5.0 x16 HHHL slots

2 PCIe 5.0 x8 HHHL slots;

Supports 8 DIMMs per node with 1DPC, up to 2TB memory capacity with 8

DIMMs of 256GB 3DS RDIMM DDR5-5600 ECC memory per node.;

Dedicated 1GbE Private Ethernet connection for node-to-node

communication (Heartbeat);

24 Hot-swap Dual Port Gen 5 U.2 NVMe SSD bays;

Redundant Titanium 2000W Power Supplies;