位置:M470T2953BY3-LD5SLASHCC > M470T2953BY3-LD5SLASHCC详情

M470T2953BY3-LD5SLASHCC中文资料

厂家型号

M470T2953BY3-LD5SLASHCC

文件大小

328.21Kbytes

页面数量

19

功能描述

200pin Unbuffered SODIMM based on 512Mb B-die 64bit Non-ECC

数据手册

下载地址一下载地址二到原厂下载

生产厂商

SAMSUNG

M470T2953BY3-LD5SLASHCC数据手册规格书PDF详情

Features

• Performance range

• JEDEC standard 1.8V ± 0.1V Power Supply

• VDDQ = 1.8V ± 0.1V

• 200 MHz fCK for 400Mb/sec/pin, 267MHz fCK for 533Mb/sec/pin

• 4 Banks

• Posted CAS

• Programmable CAS Latency: 3, 4, 5

• Programmable Additive Latency: 0, 1 , 2 , 3 and 4

• Write Latency(WL) = Read Latency(RL) -1

• Burst Length: 4 , 8(Interleave/nibble sequential)

• Programmable Sequential / Interleave Burst Mode

• Bi-directional Differential Data-Strobe (Single-ended data-strobe is an optional feature)

• Off-Chip Driver(OCD) Impedance Adjustment

• On Die Termination

• Average Refresh Period 7.8us at lower than a TCASE 85°C, 3.9us at 85°C < TCASE < 95 °C

- support High Temperature Self-Refresh rate enable feature

• Package: 60ball FBGA - 64Mx8 , 84ball FBGA - 32Mx16

• All of Lead-free products are compliant for RoHS

更新时间:2025-8-6 16:02:00
供应商 型号 品牌 批号 封装 库存 备注 价格
SAMSUNG
24+
SODIMM
35200
一级代理/放心采购
SAMSUNG
25+23+
New
32133
绝对原装正品现货,全新深圳原装进口现货
Samsung
21+
标准封装
5000
进口原装,订货渠道!
SAMSUNG
22+
252
原装现货,假一罚十
SAMSUNG/三星
23+
13000
原厂授权一级代理,专业海外优势订货,价格优势、品种
SAMSUNG(三星半导体)
24+
7350
现货供应,当天可交货!免费送样,原厂技术支持!!!
SAMSUNG(三星半导体)
22+
FBGA
23870
军用单位指定合供方/只做原装,自家现货
SAMSUNG/三星
23+
NA
3000
只做原装正品价格和数量以咨询为准
SAMSUNG/三星
23+
NA
50000
全新原装正品现货,支持订货
SAMSUNG/三星
24+
NA/
75
优势代理渠道,原装正品,可全系列订货开增值税票