位置:K4T1G084QQ-HCLE6 > K4T1G084QQ-HCLE6详情

K4T1G084QQ-HCLE6中文资料

厂家型号

K4T1G084QQ-HCLE6

文件大小

886.4Kbytes

页面数量

44

功能描述

1Gb Q-die DDR2 SDRAM Specification

数据手册

下载地址一下载地址二到原厂下载

生产厂商

SAMSUNG

K4T1G084QQ-HCLE6数据手册规格书PDF详情

The 1Gb DDR2 SDRAM is organized as a 32Mbit x 4 I/Os x 8banks, 16Mbit x 8 I/Os x 8banks or 8Mbit x 16 I/Os x 8 banks device. This synchronous device achieves high speed double data-rate transfer rates of up to 800Mb/sec/pin (DDR2-800) for general applications.

Key Features

• JEDEC standard 1.8V ± 0.1V Power Supply

• VDDQ = 1.8V ± 0.1V

• 333MHz fCK for 667Mb/sec/pin, 400MHz fCK for 800Mb/sec/pin

• 8 Banks

• Posted CAS

• Programmable CAS Latency: 3, 4, 5, 6

• Programmable Additive Latency: 0, 1, 2, 3, 4, 5

• Write Latency(WL) = Read Latency(RL) -1

• Burst Length: 4 , 8(Interleave/nibble sequential)

• Programmable Sequential / Interleave Burst Mode

• Bi-directional Differential Data-Strobe (Single-ended data strobe is an optional feature)

• Off-Chip Driver(OCD) Impedance Adjustment

• On Die Termination

• Special Function Support

- PASR(Partial Array Self Refresh)

- 50ohm ODT

- High Temperature Self-Refresh rate enable

• Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95 °C

• All of Lead-free products are compliant for RoHS

K4T1G084QQ-HCLE6产品属性

  • 类型

    描述

  • 型号

    K4T1G084QQ-HCLE6

  • 制造商

    SAMSUNG

  • 制造商全称

    Samsung semiconductor

  • 功能描述

    1Gb Q-die DDR2 SDRAM Specification

更新时间:2025-10-31 15:01:00
供应商 型号 品牌 批号 封装 库存 备注 价格
SAMSUNG
23+
BGA
8000
只做原装现货
SAMSUNG
23+
BGA
8560
受权代理!全新原装现货特价热卖!
SAMSUNG
24+
BGA
30617
三星闪存专营品牌店全新原装热卖
SAMSUNG
2023+
BGA
50000
原装现货
SAMSUNG
24+
BGA
20000
全新原厂原装,进口正品现货,正规渠道可含税!!
SAMSUNG
20+
BGA
11520
特价全新原装公司现货
SAMSUNG
25+23+
BGA
35843
绝对原装正品全新进口深圳现货
SAMSUNG/三星
24+
NA
990000
明嘉莱只做原装正品现货
SAMSUNG/三星
25+
BGA
996880
只做原装,欢迎来电资询
SAMSUNG/三星
24+
FBGA
13718
只做原装 公司现货库存