位置:K4T1G084QQ-HCF7 > K4T1G084QQ-HCF7详情

K4T1G084QQ-HCF7中文资料

厂家型号

K4T1G084QQ-HCF7

文件大小

886.4Kbytes

页面数量

44

功能描述

1Gb Q-die DDR2 SDRAM Specification

数据手册

下载地址一下载地址二到原厂下载

生产厂商

SAMSUNG

K4T1G084QQ-HCF7数据手册规格书PDF详情

The 1Gb DDR2 SDRAM is organized as a 32Mbit x 4 I/Os x 8banks, 16Mbit x 8 I/Os x 8banks or 8Mbit x 16 I/Os x 8 banks device. This synchronous device achieves high speed double data-rate transfer rates of up to 800Mb/sec/pin (DDR2-800) for general applications.

Key Features

• JEDEC standard 1.8V ± 0.1V Power Supply

• VDDQ = 1.8V ± 0.1V

• 333MHz fCK for 667Mb/sec/pin, 400MHz fCK for 800Mb/sec/pin

• 8 Banks

• Posted CAS

• Programmable CAS Latency: 3, 4, 5, 6

• Programmable Additive Latency: 0, 1, 2, 3, 4, 5

• Write Latency(WL) = Read Latency(RL) -1

• Burst Length: 4 , 8(Interleave/nibble sequential)

• Programmable Sequential / Interleave Burst Mode

• Bi-directional Differential Data-Strobe (Single-ended data strobe is an optional feature)

• Off-Chip Driver(OCD) Impedance Adjustment

• On Die Termination

• Special Function Support

- PASR(Partial Array Self Refresh)

- 50ohm ODT

- High Temperature Self-Refresh rate enable

• Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95 °C

• All of Lead-free products are compliant for RoHS

更新时间:2025-10-31 20:07:00
供应商 型号 品牌 批号 封装 库存 备注 价格
SAMSUNG
存储器
BGA
40330
SAMSUNG存储芯片K4T1G084QQ-HCF7即刻询购立享优惠#长期有货
SAMSUNG/三星
21+
BGA
20000
原装现货假一罚十
SAMSUNG
2021+
FBGA
6800
原厂原装,欢迎咨询
SAMSUNG/三星
23+
BGA
12500
全新原装现货,假一赔十
SAMSUNG/三星
BGA
23+
6000
专业配单原装正品假一罚十
SAMSUNG/三星
21+
BGA
6000
全新原装 公司现货 价格优
SAMSUNG/三星
10+
BGA
937
原装正品 可含税交易
SAMSUNG
22+
BGA
8000
原装正品支持实单
SAMSUNG
21+
BGA
939
只做原装正品,不止网上数量,欢迎电话微信查询!
SAMSUNG
17+
BGA
6200
100%原装正品现货