型号 功能描述 生产厂家 企业 LOGO 操作

Bluetooth Class 2 Module

Description SPG Bluetooth Class 2 Module is a highly integrated module for fast implementation in various applications to enable electronic devices to communicate wirelessly with other Bluetooth enabled devices. It is a true saver for manufacturers to provide time-to-market products. Features

STMICROELECTRONICS

意法半导体

Bluetooth class 2 module with embedded HCI FW

Description ST Bluetooth Modules are highly integrated for easy implementation in embedded applications. Class 2 modules enable wireless communication with other Bluetooth enabled devices up to 10 m away. The GS-BT2416C2.H integrates on a unique FR4 PCB support: BT 1.2 radio and baseband, memory,

STMICROELECTRONICS

意法半导体

Bluetooth class 2 module with embedded SPP SW

文件:804.53 Kbytes Page:32 Pages

STMICROELECTRONICS

意法半导体

更新时间:2025-11-3 17:29:01
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
MOT
24+
QFP
30617
一级代理全新原装热卖
FREESCAL
23+
BGAQFP
8659
原装公司现货!原装正品价格优势.
MOTOROLA
24+
QFP
6980
原装现货,可开13%税票
ST优势
MODULE
2682
正品原装--自家现货-实单可谈
A
24+
PLCC-84
10
STMicroelect
NEW
Module
8795
代理全系列销售,全新原装正品,价格优势,长期供应,量大可订
MOTOROLA
16+
QFP
960
进口原装现货/价格优势!
LEMO
25
全新原装 货期两周
MOROTOLA
2138+
QFP
8960
专营BGA,QFP原装现货,假一赔十
MOT
QFP
5350
一级代理 原装正品假一罚十价格优势长期供货

STA2416C2数据表相关新闻