型号 功能描述 生产厂家 企业 LOGO 操作
SST32HF802-70-4C-LBKE

Multi-Purpose Flash (MPF) SRAM ComboMemory

PRODUCT DESCRIPTION The SST32HF20x/40x ComboMemory devices integrate a 128K x16 or 256K x16 CMOS flash memory bank with a 64K x16 or 128K x16 CMOS SRAM memory bank in a Multi-Chip Package (MCP), manufactured with SST’s proprietary, high performance SuperFlash technology. FEATURES: • MPF + SRAM

SST

Silicon Storage Technology, Inc

Multi-Purpose Flash (MPF) SRAM ComboMemory

PRODUCT DESCRIPTION The SST32HF802/162/164 ComboMemory devices integrate a 512K x16 or 1M x16 CMOS flash memory bank with a 128K x16 or 256K x16 CMOS SRAM memory bank in a Multi-Chip Package (MCP), manufactured with SST’s proprietary, high performance SuperFlash technology. FEATURES: • MPF + SR

SST

Silicon Storage Technology, Inc

Multi-Purpose Flash (MPF) SRAM ComboMemory

PRODUCT DESCRIPTION The SST32HF20x/40x ComboMemory devices integrate a 128K x16 or 256K x16 CMOS flash memory bank with a 64K x16 or 128K x16 CMOS SRAM memory bank in a Multi-Chip Package (MCP), manufactured with SST’s proprietary, high performance SuperFlash technology. FEATURES: • MPF + SRAM

SST

Silicon Storage Technology, Inc

Multi-Purpose Flash (MPF) SRAM ComboMemory

PRODUCT DESCRIPTION The SST32HF802/162/164 ComboMemory devices integrate a 512K x16 or 1M x16 CMOS flash memory bank with a 128K x16 or 256K x16 CMOS SRAM memory bank in a Multi-Chip Package (MCP), manufactured with SST’s proprietary, high performance SuperFlash technology. FEATURES: • MPF + SR

SST

Silicon Storage Technology, Inc

Multi-Purpose Flash (MPF) SRAM ComboMemory

PRODUCT DESCRIPTION The SST32HF802/162/164 ComboMemory devices integrate a 512K x16 or 1M x16 CMOS flash memory bank with a 128K x16 or 256K x16 CMOS SRAM memory bank in a Multi-Chip Package (MCP), manufactured with SST’s proprietary, high performance SuperFlash technology. FEATURES: • MPF + SR

SST

Silicon Storage Technology, Inc

SST32HF802-70-4C-LBKE产品属性

  • 类型

    描述

  • 型号

    SST32HF802-70-4C-LBKE

  • 功能描述

    组合存储器 8M FLASH 2M SRAM

  • RoHS

  • 制造商

    Microchip Technology

  • 组织

    512 K x 16

  • 最大工作温度

    + 85 C

  • 最小工作温度

    - 20 C

  • 封装/箱体

    LFBGA-48

  • 封装

    Tray

更新时间:2026-3-5 17:28:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
SeCoS
20+
SOT23-6
43000
原装优势主营型号-可开原型号增税票
KODENSHI
25+
650
只做原装鄙视假货15118075546
SST
23+
11200
原厂授权一级代理、全球订货优势渠道、可提供一站式BO
SST
2023+
BGA
2400
原厂全新正品旗舰店优势现货
SST
2223+
BGA
26800
只做原装正品假一赔十为客户做到零风险
SST
24+
BGA
2000
原装现货,可开13%税票
SST
2402+
BGA
8324
原装正品!实单价优!
SST
22+
BGA
8000
原装现货库存.价格优势
SST
24+
BGA
65200
一级代理/放心采购
SST
24+
BGA
6232
公司原厂原装现货假一罚十!特价出售!强势库存!

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