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SN74ABT827价格
参考价格：￥6.1195
型号：SN74ABT827DBR 品牌：TI 备注：这里有SN74ABT827多少钱，2026年最近7天走势，今日出价，今日竞价，SN74ABT827批发/采购报价，SN74ABT827行情走势销售排行榜，SN74ABT827报价。| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
SN74ABT827 | 10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS State-of-the-Art EPIC-ΙΙB BiCMOS Design Significantly Reduces Power Dissipation Flow-Through Architecture Optimizes PCB Layout Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) | TI 德州仪器 |   | |
SN74ABT827 | 10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS State-of-the-Art EPIC-ΙΙB BiCMOS Design Significantly Reduces Power Dissipation Flow-Through Architecture Optimizes PCB Layout Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) | TI 德州仪器 | | |
SN74ABT827 | 具有 TTL 兼容型 CMOS 输入和三态输出的 10 通道、4.5V 至 5.5V 缓冲器 | TI 德州仪器 | | |
SN74ABT827 | 10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS 文件：896.49 Kbytes Page：17 Pages | TI 德州仪器 | | |
SN74ABT827 | 10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS 文件：399.74 Kbytes Page：16 Pages | TI 德州仪器 | | |
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS State-of-the-Art EPIC-ΙΙB BiCMOS Design Significantly Reduces Power Dissipation Flow-Through Architecture Optimizes PCB Layout Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS State-of-the-Art EPIC-ΙΙB BiCMOS Design Significantly Reduces Power Dissipation Flow-Through Architecture Optimizes PCB Layout Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS State-of-the-Art EPIC-ΙΙB BiCMOS Design Significantly Reduces Power Dissipation Flow-Through Architecture Optimizes PCB Layout Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS State-of-the-Art EPIC-ΙΙB BiCMOS Design Significantly Reduces Power Dissipation Flow-Through Architecture Optimizes PCB Layout Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS State-of-the-Art EPIC-ΙΙB BiCMOS Design Significantly Reduces Power Dissipation Flow-Through Architecture Optimizes PCB Layout Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS State-of-the-Art EPIC-ΙΙB BiCMOS Design Significantly Reduces Power Dissipation Flow-Through Architecture Optimizes PCB Layout Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS State-of-the-Art EPIC-ΙΙB BiCMOS Design Significantly Reduces Power Dissipation Flow-Through Architecture Optimizes PCB Layout Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS State-of-the-Art EPIC-ΙΙB BiCMOS Design Significantly Reduces Power Dissipation Flow-Through Architecture Optimizes PCB Layout Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS State-of-the-Art EPIC-ΙΙB BiCMOS Design Significantly Reduces Power Dissipation Flow-Through Architecture Optimizes PCB Layout Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS State-of-the-Art EPIC-ΙΙB BiCMOS Design Significantly Reduces Power Dissipation Flow-Through Architecture Optimizes PCB Layout Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS State-of-the-Art EPIC-ΙΙB BiCMOS Design Significantly Reduces Power Dissipation Flow-Through Architecture Optimizes PCB Layout Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS State-of-the-Art EPIC-ΙΙB BiCMOS Design Significantly Reduces Power Dissipation Flow-Through Architecture Optimizes PCB Layout Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS State-of-the-Art EPIC-ΙΙB BiCMOS Design Significantly Reduces Power Dissipation Flow-Through Architecture Optimizes PCB Layout Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS State-of-the-Art EPIC-ΙΙB BiCMOS Design Significantly Reduces Power Dissipation Flow-Through Architecture Optimizes PCB Layout Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS State-of-the-Art EPIC-ΙΙB BiCMOS Design Significantly Reduces Power Dissipation Flow-Through Architecture Optimizes PCB Layout Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS State-of-the-Art EPIC-ΙΙB BiCMOS Design Significantly Reduces Power Dissipation Flow-Through Architecture Optimizes PCB Layout Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS State-of-the-Art EPIC-ΙΙB BiCMOS Design Significantly Reduces Power Dissipation Flow-Through Architecture Optimizes PCB Layout Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS State-of-the-Art EPIC-ΙΙB BiCMOS Design Significantly Reduces Power Dissipation Flow-Through Architecture Optimizes PCB Layout Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS State-of-the-Art EPIC-ΙΙB BiCMOS Design Significantly Reduces Power Dissipation Flow-Through Architecture Optimizes PCB Layout Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS State-of-the-Art EPIC-ΙΙB BiCMOS Design Significantly Reduces Power Dissipation Flow-Through Architecture Optimizes PCB Layout Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS State-of-the-Art EPIC-ΙΙB BiCMOS Design Significantly Reduces Power Dissipation Flow-Through Architecture Optimizes PCB Layout Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS State-of-the-Art EPIC-ΙΙB BiCMOS Design Significantly Reduces Power Dissipation Flow-Through Architecture Optimizes PCB Layout Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS State-of-the-Art EPIC-ΙΙB BiCMOS Design Significantly Reduces Power Dissipation Flow-Through Architecture Optimizes PCB Layout Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS 文件：399.74 Kbytes Page：16 Pages | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS 文件：399.74 Kbytes Page：16 Pages | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS 文件：896.49 Kbytes Page：17 Pages | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS 文件：896.49 Kbytes Page：17 Pages | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS 文件：399.74 Kbytes Page：16 Pages | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS 文件：399.74 Kbytes Page：16 Pages | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS 文件：399.74 Kbytes Page：16 Pages | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS 文件：896.49 Kbytes Page：17 Pages | TI 德州仪器 | | ||
封装/外壳：24-SOIC（0.295"，7.50mm 宽） 包装：管件 描述：IC BUF NON-INVERT 5.5V 24SOIC 集成电路（IC） 缓冲器，驱动器，接收器，收发器 | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS 文件：399.74 Kbytes Page：16 Pages | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS 文件：399.74 Kbytes Page：16 Pages | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS 文件：896.49 Kbytes Page：17 Pages | TI 德州仪器 | | ||
封装/外壳：24-SOIC（0.295"，7.50mm 宽） 包装：管件 描述：IC BUF NON-INVERT 5.5V 24SOIC 集成电路（IC） 缓冲器，驱动器，接收器，收发器 | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS 文件：399.74 Kbytes Page：16 Pages | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS 文件：399.74 Kbytes Page：16 Pages | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS 文件：399.74 Kbytes Page：16 Pages | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS 文件：399.74 Kbytes Page：16 Pages | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS 文件：399.74 Kbytes Page：16 Pages | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS 文件：399.74 Kbytes Page：16 Pages | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS 文件：896.49 Kbytes Page：17 Pages | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS 文件：399.74 Kbytes Page：16 Pages | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS 文件：896.49 Kbytes Page：17 Pages | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS 文件：399.74 Kbytes Page：16 Pages | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS 文件：896.49 Kbytes Page：17 Pages | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS 文件：399.74 Kbytes Page：16 Pages | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS 文件：896.49 Kbytes Page：17 Pages | TI 德州仪器 | | ||
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS 文件：399.74 Kbytes Page：16 Pages | TI 德州仪器 | | ||
10-bit buffer/line driver, non-inverting 3-State DESCRIPTION The 74ABT827 high-performance BiCMOS device combines low static and dynamic power dissipation with high speed and high output drive. FEATURES • Ideal where high speed, light loading, or increased fan-in are required • Flow through pinout architecture for microprocessor or | Philips 飞利浦 | | ||
10-bit buffer/line driver; non-inverting; 3-state | ETC 知名厂家 | ETC | | |
10-bit buffer/line driver; non-inverting; 3-state | ETC 知名厂家 | ETC | | |
10-bit buffer/line driver, non-inverting 3-State DESCRIPTION The 74ABT827 high-performance BiCMOS device combines low static and dynamic power dissipation with high speed and high output drive. FEATURES • Ideal where high speed, light loading, or increased fan-in are required • Flow through pinout architecture for microprocessor or | Philips 飞利浦 | | ||
10-bit buffer/line driver, non-inverting 3-State DESCRIPTION The 74ABT827 high-performance BiCMOS device combines low static and dynamic power dissipation with high speed and high output drive. FEATURES • Ideal where high speed, light loading, or increased fan-in are required • Flow through pinout architecture for microprocessor or | Philips 飞利浦 | |
SN74ABT827产品属性
- 类型
描述
- 型号
SN74ABT827
- 功能描述
缓冲器和线路驱动器 Tri-State 10-Bit
- RoHS
否
- 制造商
Micrel
- 输入线路数量
1
- 输出线路数量
2
- 极性
Non-Inverting
- 电源电压-最大
+/- 5.5 V
- 电源电压-最小
+/- 2.37 V
- 最大工作温度
+ 85 C
- 安装风格
SMD/SMT
- 封装/箱体
MSOP-8
- 封装
Reel
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TI/德州仪器 |
24+ |
SOIC-24_300mil |
6000 |
全新原装深圳仓库现货有单必成 |
|||
TI(德州仪器) |
25+ |
N/A |
6000 |
原装，请咨询 |
|||
TI/TEXAS |
NEW |
24SOIC |
8931 |
代理全系列销售, 全新原装正品,价格优势,长期供应,量大可订 |
|||
TI/德州仪器 |
23+ |
TSSOP-24 |
11200 |
原厂授权一级代理、全球订货优势渠道、可提供一站式BO |
|||
Rochester |
25+ |
电联咨询 |
7800 |
公司现货,提供拆样技术支持 |
|||
TI/德州仪器 |
2022+ |
SOIC-24_300mil |
7600 |
原厂原装,假一罚十 |
|||
TI |
22+ |
24TSSOP |
9000 |
原厂渠道,现货配单 |
|||
TMS |
06+ |
SOIC |
1000 |
自己公司全新库存绝对有货 |
|||
TEXAS |
20+ |
SOP |
2960 |
诚信交易大量库存现货 |
|||
TI/德州仪器 |
24+ |
TSSOP24 |
1500 |
只供应原装正品 欢迎询价 |
SN74ABT827规格书下载地址
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https://hch01.114ic.com/
2020-11-13
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