AC/DC PWM 功率开关

SM7055是一款高精度非隔离降压恒压控制芯片，适用于85Vac~265Vac全电压范围应用，内部集成650V高压功率管，内置CS电阻，无需外部补偿元件，即可实现优异的线性调整率和负载调整率，外围元件极少，大大的降低了系统的成本，节约了PCB的尺寸。 •输入电压：85Vac~265Vac\n•拓扑结构支持：低成本BUCK、BUCK-BOOST等方案\n•采用650V单芯片集成工艺\n•待机功耗小于60mW@220Vac\n•集成高压启动电路\n•集成高压功率开关\n•60KHz固定开关频率\n•电流模式PWM控制方式\n•内置抖频技术，提升EMC性能\n•内置过温、过流、过压、欠压等保护功能\n•内置软启动\n•内置智能软驱动技术（提高EMC性能）\n•封装形式： DIP8;

AC / DC PWM power switch

文件：4.00312 Mbytes Page：7 Pages

高压电源驱动-非隔离恒压

SM7055-12是一款高精度非隔离降压恒压控制芯片，适用于85Vac~265Vac全电压范围应用；SM7055-12内部集成650V高压功率管，内置CS电阻，无需外部补偿元件，即可实现优异的线性调整率和负载调整率，外围元件极少，大大的降低了系统的成本，节约了PCB的尺寸。 •输入电压：85Vac~265Vac\n•拓扑结构支持：低成本BUCK、BUCK-BOOST等方案\n•采用650V单芯片集成工艺\n•待机功耗小于60mW@220Vac\n•集成高压启动电路\n•集成高压功率开关\n•60KHz固定开关频率\n•电流模式PWM控制方式\n•内置抖频技术，提升EMC性能\n•内置过温、过流、过压、欠压等保护功能\n•内置软启动\n•内置智能软驱动技术（提高EMC性能）\n•封装形式：TO252-2、TO251;

高压电源驱动-非隔离恒压

SM7055-18是一款高精度非隔离降压恒压控制芯片，适用于85Vac~265Vac全电压范围应用；SM7055-18内部集成650V高压功率管，内置CS电阻，无需外部补偿元件，即可实现优异的线性调整率和负载调整率，外围元件极少，大大的降低了系统的成本，节约了PCB的尺寸。 •输入电压：85Vac~265Vac\n•拓扑结构支持：低成本BUCK、BUCK-BOOST等方案\n•采用650V单芯片集成工艺\n•待机功耗小于60mW@220Vac\n•集成高压启动电路\n•集成高压功率开关\n•60KHz固定开关频率\n•电流模式PWM控制方式\n•内置抖频技术，提升EMC性能\n•内置过温、过流、过压、欠压等保护功能\n•内置软启动\n•内置智能软驱动技术（提高EMC性能）\n•封装形式：TO252-2、TO251;

AC / DC PWM power switch

文件：5.71133 Mbytes Page：9 Pages

AC / DC PWM power switch

文件：5.45144 Mbytes Page：9 Pages

Advanced PWM and Linear Power Controller

General Description The APW7055 provides the power control and protections for two output voltages on M/B DDR applications. It integrates one PWM controller , one source-sink linear controller(LC) for DDR source-sink purpose, as well as the monitor and protection functions into a single package.

Bluetooth Baseband Controller IC

GENERAL DESCRIPTION The ML7055 is a CMOS digital IC for use in 2.4 GHz band Bluetooth™ systems. This IC incorporates the ARM7TDMI as the CPU core, features a highly expandable architecture, and supports the interfaces for a variety of applications. Since the ML7055 has Oki’s Bluetooth protocol s

Bluetooth Baseband Controller IC

GENERAL DESCRIPTION The ML7055 is a CMOS digital IC for use in 2.4 GHz band Bluetooth™ systems. This IC incorporates the ARM7TDMI as the CPU core, features a highly expandable architecture, and supports the interfaces for a variety of applications. Since the ML7055 has Oki’s Bluetooth protocol s

Renesas 32-Bit Single-Chip RISC Microprocessor SuperH RISC engine Family/SH7040 Series(CPU Core SH-2)

Features The SH7055SF is a single-chip RISC microcontroller that integrates a RISC CPU core using an original Renesas architecture with peripheral functions required for system configuration. The CPU has a RISC-type instruction set. Basic instructions can be executed in one state (one system

ULTRA FAST RECOVERY MODULES

Ultrafast Recovery Modules ● Ultra Fast Recovery ● 175°C Junction Temperature ● VRRM 100 to 800 Volts ● Unique surface mount package ● 2 X 35 Amp current rating ● ROHS Compliant