Surface Mount Devices

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PPTC/自恢复保险丝

CERAMIC MELF PIN DIODES

DESCRIPTION This new line of ‘MELF’ high power PIN diodes are hermetically sealed surface mount packaged devices with full face bonded chips for low inductance construction. The MELF ceramic package has square end terminations which are ideal for surface mount and pick and place operations. The P

Surface Mount PIN Diodes

This line of \"MELF\" high power PIN diodes are hermetically sealed surface mount packaged devices with full face bonded chips for low inductance construction. The MELF ceramic package has square end terminations which are ideal for surface mount and pick and place operations. The PIN diode chips ar

CERAMIC MELF PIN DIODES

DESCRIPTION This new line of ‘MELF’ high power PIN diodes are hermetically sealed surface mount packaged devices with full face bonded chips for low inductance construction. The MELF ceramic package has square end terminations which are ideal for surface mount and pick and place operations. The P

CERAMIC MELF PIN DIODES

DESCRIPTION This new line of ‘MELF’ high power PIN diodes are hermetically sealed surface mount packaged devices with full face bonded chips for low inductance construction. The MELF ceramic package has square end terminations which are ideal for surface mount and pick and place operations. The P

CERAMIC MELF PIN DIODES

DESCRIPTION This new line of ‘MELF’ high power PIN diodes are hermetically sealed surface mount packaged devices with full face bonded chips for low inductance construction. The MELF ceramic package has square end terminations which are ideal for surface mount and pick and place operations. The P

包装：散装 描述：CAP LITH HYBRID 500F 16V 电容器 双电层电容器（EDLC），超级电容器

CONTROL DEVICES Surface Mount-Melf pin diodes

CONTROL DEVICES Surface Mount-Melf pin diodes

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封装/外壳：1208（3020 公制） 包装：卷带（TR） 描述：RF DIODE PIN 500V M1 分立半导体产品 二极管 - 射频

HIGH SPEED DIFFERENTIAL LINE DRIVERS AND RECEIVERS

DESCRIPTION The STLVDS050 is differential line drivers and receivers that use low-voltage differential signaling (LVDS) to achieve signaling rate as high as 400Mbps. The EIA/TIA-644 standard compliant electrical interface provides a minimum differential output voltage magnitude of 247 mV into a

HIGH SPEED DIFFERENTIAL LINE DRIVERS AND RECEIVERS

DESCRIPTION The STLVDS050 is differential line drivers and receivers that use low-voltage differential signaling (LVDS) to achieve signaling rate as high as 400Mbps. The EIA/TIA-644 standard compliant electrical interface provides a minimum differential output voltage magnitude of 247 mV into a

HIGH SPEED DIFFERENTIAL LINE DRIVERS AND RECEIVERS

DESCRIPTION The STLVDS050 is differential line drivers and receivers that use low-voltage differential signaling (LVDS) to achieve signaling rate as high as 400Mbps. The EIA/TIA-644 standard compliant electrical interface provides a minimum differential output voltage magnitude of 247 mV into a

HIGH SPEED DIFFERENTIAL LINE DRIVERS AND RECEIVERS

DESCRIPTION The STLVDS050 is differential line drivers and receivers that use low-voltage differential signaling (LVDS) to achieve signaling rate as high as 400Mbps. The EIA/TIA-644 standard compliant electrical interface provides a minimum differential output voltage magnitude of 247 mV into a

HIGH SIDE SMART POWER SOLID STATE RELAY

DESCRIPTION The VN05H is a monolithic devices made using SGS-THOMSON Vertical Intelligent Power Technology, intended for driving resistive or inductive loads with one side grounded. Built-in thermal shut-down protects the chip from over temperature and short circuit. The input control is 5V log