CERAMIC MELF PIN DIODES

DESCRIPTION This new line of ‘MELF’ high power PIN diodes are hermetically sealed surface mount packaged devices with full face bonded chips for low inductance construction. The MELF ceramic package has square end terminations which are ideal for surface mount and pick and place operations. The P

CONTROL DEVICES Surface Mount-Melf pin diodes

Surface Mount PIN Diodes

This line of \"MELF\" high power PIN diodes are hermetically sealed surface mount packaged devices with full face bonded chips for low inductance construction. The MELF ceramic package has square end terminations which are ideal for surface mount and pick and place operations. The PIN diode chips ar

CONTROL DEVICES Surface Mount-Melf pin diodes

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封装/外壳：1208（3020 公制） 包装：卷带（TR） 描述：RF DIODE PIN 500V M1 分立半导体产品 二极管 - 射频

封装/外壳：1208（3020 公制） 包装：卷带（TR） 描述：SI PIN HERMETIC MELF 分立半导体产品 二极管 - 射频

TVS Diode Arrays - Surface Mount TVS Avalanche Diode Array

Surface Mount TVS Avalanche Diode Array The surface mount family of arrays are designed to suppress ESD and other transient overvoltage events. These arrays are used to meet the International Electrotechnical Compatibility (IEC transient immunity standards IEC 61000-4-2 for Electrostatic Discharg

CCD SENSORS ANALOG PROCESSOR IC

DESCRIPTION The chip integrates the analog functions needed in a CCD Video Camera, more particularly for video conferencing purpose. The CCD signal is sampled, amplified to a useful level and digitized by an 8 bits ADC. The gain of the amplifier and the black level clamp can be adjusted by a ser

SMD Genenal Purpose Rectifier

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Silicon Schottky Barrier Diode for Rectifying

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Silicon Protection Circuits - TVS Rail Clamp Array in a Surface Mount Package

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