型号 功能描述 生产厂家 企业 LOGO 操作

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

Power Module 100 Amp

文件:192.19 Kbytes Page:1 Pages

TEL

STANDARD DIODES

文件:120.77 Kbytes Page:7 Pages

IRF

更新时间:2025-12-30 9:05:01
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
IR
专业模块
MODULE
8513
模块原装主营-可开原型号增税票
IR
23+
MODULE
7000
IR
2015
模块
300
十七年VIP会员,诚信经营,一手货源,原装正品可零售!
IR
24+
NA
4500
只做原装正品现货 欢迎来电查询15919825718
原厂
2023+
模块
600
专营模块,继电器,公司原装现货
IR
23+
MODULE
8000
只做原装现货
IR
22+
MODULE
6000
终端可免费供样,支持BOM配单
IR
23+
MODULE
10000
原厂授权一级代理,专业海外优势订货,价格优势、品种
IR
2023+环保现货
模块
10
专注军工、汽车、医疗、工业等方案配套一站式服务

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