FRED芯片

• 采用先进的Photo Glass工艺，从技术上提升了芯片的可靠性。\n\n• 采用多层外延技术，显著提升了产品的软恢复特性，增强了产品的抗线路的冲击的能力，提升了产品的可靠性。\n\n• 均匀的TRR分布以及超低的VF分布，体现了芯片优良的常温特性。

Glass Passivated Super Fast Recovery Rectifier

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超高速恢复整流器(trr 35ns)

Super Fast

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