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型号 功能描述 生产厂家 企业 LOGO 操作

Memory Micromodules General Information for D1, D2 and C Packaging

DESCRIPTION Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip). ■ Micromodules were developed specifically for embedding in Smartcards and Memory Cards ■ The Micromodule provides: – Support for the chi

STMICROELECTRONICS

意法半导体

5-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms

DESCRIPTION The members of the ST1335/1336/1355 family are principally designed for use in prepaid Phonecard applications. Each is a 272-bit EEPROM device, with associated security logic and special fuses to control memory access. The memory is arranged as a matrix of 34 x 8 cells, accessed in

STMICROELECTRONICS

意法半导体

RS232/EIA562/RS485 Transceivers

文件:454.5 Kbytes Page:20 Pages

LINER

凌力尔特

RS232/EIA562/RS485 Transceivers

文件:454.5 Kbytes Page:20 Pages

LINER

凌力尔特

Universal Serial Bus USB Audio Playback Recording Peripheral APRP

文件:254.95 Kbytes Page:44 Pages

PHILIPS

飞利浦

SED1335FOA产品属性

  • 类型

    描述

  • 型号

    SED1335FOA

  • 功能描述

    LCD 驱动器 SMOS Controller Chip

  • RoHS

  • 制造商

    Maxim Integrated

  • 数位数量

    4.5

  • 片段数量

    30

  • 最大时钟频率

    19 KHz

  • 工作电源电压

    3 V to 3.6 V

  • 最大工作温度

    + 85 C

  • 最小工作温度

    - 20 C

  • 封装/箱体

    PDIP-40

  • 封装

    Tube

更新时间:2026-5-20 9:06:02
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
ST/意法
25+
DIP8
550
全新原装正品支持含税
ST
10+
DIP8
7800
全新原装正品,现货销售

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