位置：首页 > IC中文资料第11743页 > ST1335
| 型号 | 功能描述 | 生产厂家&企业 | LOGO | 操作 |
|---|---|---|---|---|
ST1335 | Memory Micromodules General Information for D1, D2 and C Packaging DESCRIPTION Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip). ■ Micromodules were developed specifically for embedding in Smartcards and Memory Cards ■ The Micromodule provides: – Support for the chi | STMICROELECTRONICS 意法半导体 |   | |
ST1335 | 5-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms DESCRIPTION The members of the ST1335/1336/1355 family are principally designed for use in prepaid Phonecard applications. Each is a 272-bit EEPROM device, with associated security logic and special fuses to control memory access. The memory is arranged as a matrix of 34 x 8 cells, accessed in | STMICROELECTRONICS 意法半导体 | | |
5-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms DESCRIPTION The members of the ST1335/1336/1355 family are principally designed for use in prepaid Phonecard applications. Each is a 272-bit EEPROM device, with associated security logic and special fuses to control memory access. The memory is arranged as a matrix of 34 x 8 cells, accessed in | STMICROELECTRONICS 意法半导体 | | ||
5-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms DESCRIPTION The members of the ST1335/1336/1355 family are principally designed for use in prepaid Phonecard applications. Each is a 272-bit EEPROM device, with associated security logic and special fuses to control memory access. The memory is arranged as a matrix of 34 x 8 cells, accessed in | STMICROELECTRONICS 意法半导体 | | ||
5-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms DESCRIPTION The members of the ST1335/1336/1355 family are principally designed for use in prepaid Phonecard applications. Each is a 272-bit EEPROM device, with associated security logic and special fuses to control memory access. The memory is arranged as a matrix of 34 x 8 cells, accessed in | STMICROELECTRONICS 意法半导体 | | ||
5-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms DESCRIPTION The members of the ST1335/1336/1355 family are principally designed for use in prepaid Phonecard applications. Each is a 272-bit EEPROM device, with associated security logic and special fuses to control memory access. The memory is arranged as a matrix of 34 x 8 cells, accessed in | STMICROELECTRONICS 意法半导体 | | ||
5-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms DESCRIPTION The members of the ST1335/1336/1355 family are principally designed for use in prepaid Phonecard applications. Each is a 272-bit EEPROM device, with associated security logic and special fuses to control memory access. The memory is arranged as a matrix of 34 x 8 cells, accessed in | STMICROELECTRONICS 意法半导体 | | ||
5-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms DESCRIPTION The members of the ST1335/1336/1355 family are principally designed for use in prepaid Phonecard applications. Each is a 272-bit EEPROM device, with associated security logic and special fuses to control memory access. The memory is arranged as a matrix of 34 x 8 cells, accessed in | STMICROELECTRONICS 意法半导体 | | ||
5-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms DESCRIPTION The members of the ST1335/1336/1355 family are principally designed for use in prepaid Phonecard applications. Each is a 272-bit EEPROM device, with associated security logic and special fuses to control memory access. The memory is arranged as a matrix of 34 x 8 cells, accessed in | STMICROELECTRONICS 意法半导体 | | ||
5-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms DESCRIPTION The members of the ST1335/1336/1355 family are principally designed for use in prepaid Phonecard applications. Each is a 272-bit EEPROM device, with associated security logic and special fuses to control memory access. The memory is arranged as a matrix of 34 x 8 cells, accessed in | STMICROELECTRONICS 意法半导体 | | ||
5-Contact Memory Card IC 272-bit EEPROM With Advanced Security Mechanisms and Inlock System DESCRIPTION The members of the ST1335D/36D/55D family are principally designed for use in prepaid Phonecard applications. Each is a 272-bit EEPROM device, with associated security logic and special fuses to control memory access. The memory is arranged as a matrix of 34 x 8 cells, accessed in a | STMICROELECTRONICS 意法半导体 | | ||
5-Contact Memory Card IC 272-bit EEPROM With Advanced Security Mechanisms and Inlock System DESCRIPTION The members of the ST1335D/36D/55D family are principally designed for use in prepaid Phonecard applications. Each is a 272-bit EEPROM device, with associated security logic and special fuses to control memory access. The memory is arranged as a matrix of 34 x 8 cells, accessed in a | STMICROELECTRONICS 意法半导体 | | ||
5-Contact Memory Card IC 272-bit EEPROM With Advanced Security Mechanisms and Inlock System DESCRIPTION The members of the ST1335D/36D/55D family are principally designed for use in prepaid Phonecard applications. Each is a 272-bit EEPROM device, with associated security logic and special fuses to control memory access. The memory is arranged as a matrix of 34 x 8 cells, accessed in a | STMICROELECTRONICS 意法半导体 | | ||
5-Contact Memory Card IC 272-bit EEPROM With Advanced Security Mechanisms and Inlock System DESCRIPTION The members of the ST1335D/36D/55D family are principally designed for use in prepaid Phonecard applications. Each is a 272-bit EEPROM device, with associated security logic and special fuses to control memory access. The memory is arranged as a matrix of 34 x 8 cells, accessed in a | STMICROELECTRONICS 意法半导体 | | ||
5-Contact Memory Card IC 272-bit EEPROM With Advanced Security Mechanisms and Inlock System DESCRIPTION The members of the ST1335D/36D/55D family are principally designed for use in prepaid Phonecard applications. Each is a 272-bit EEPROM device, with associated security logic and special fuses to control memory access. The memory is arranged as a matrix of 34 x 8 cells, accessed in a | STMICROELECTRONICS 意法半导体 | | ||
Strain Relief Mounting Hole Punches 文件：130.259 Kbytes Page：1 Pages | HeycoHeyco. 海科 | | ||
Strain Relief Mounting Hole Punches 文件：130.259 Kbytes Page：1 Pages | HeycoHeyco. 海科 | | ||
Strain Relief Mounting Hole Punches 文件：130.259 Kbytes Page：1 Pages | HeycoHeyco. 海科 | | ||
Strain Relief Mounting Hole Punches 文件：130.259 Kbytes Page：1 Pages | HeycoHeyco. 海科 | | ||
Strain Relief Mounting Hole Punches 文件：130.259 Kbytes Page：1 Pages | HeycoHeyco. 海科 | |
ST1335产品属性
- 类型
描述
- 型号
ST1335
- 制造商
STMICROELECTRONICS
- 制造商全称
STMicroelectronics
- 功能描述
Memory Micromodules General Information for D1, D2 and C Packaging
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
XG |
25+ |
DIP-3 |
65428 |
百分百原装现货 实单必成 |
|||
LONEON |
24+ |
NA/ |
29985 |
原厂直销,现货供应,账期支持! |
|||
LONEON |
24+ |
DIP-4 |
880000 |
明嘉莱只做原装正品现货 |
|||
LONEON |
2021+ |
DIP-4 |
25635 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
|||
ST |
23+ |
原厂原封 |
16900 |
正规渠道,只有原装! |
|||
ST |
1715+ |
SOP |
251156 |
只做原装正品现货假一赔十! |
|||
LONEON |
25+23+ |
DIP-4 |
31649 |
绝对原装正品全新进口深圳现货 |
|||
LONEON |
2223+ |
DIP-4 |
26800 |
只做原装正品假一赔十为客户做到零风险 |
|||
LONEON |
23+ |
DIP-4 |
30000 |
代理全新原装现货,价格优势 |
|||
ST |
24+ |
SQFP144 |
3629 |
原装优势!房间现货!欢迎来电! |
ST1335规格书下载地址
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- ST12100
- ST1208
- ST1200C
- ST1200
- ST11-PC
- ST11-H
- ST1155B
ST1335数据表相关新闻
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2019-3-7
DdatasheetPDF页码索引
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