■Features

●MCL-E-705G has low CTE values in X,Y directions and

　reduces warpage of package substrate significantly.

●MCL-E-705G Type（L） has lower CTE value（侑5ppm/℃).

●MCL-E-705G Type（LH） has lower CTE value（3ppm/℃).

●Well-suited for build-up construction.

■Applications

●Semiconductor packages.

　（FC-BGA,FC-CSP,PoP,SiP）

●HDI,PWB

●Thinner module,PWB