位置:M6MGT331S4BKT > M6MGT331S4BKT详情

M6MGT331S4BKT中文资料

厂家型号

M6MGT331S4BKT

文件大小

171.32Kbytes

页面数量

3

功能描述

33,554,432-BIT (2,097,152 - WORD BY 16-BIT/4,194,304-WORD BY 8-BIT) CMOS 3.3V-ONLY FLASH MEMORY & 4,194,304-BIT (262,144-WORD BY 16-BIT/524,288-WORD B

33,554,432-BIT(2,097,152 - WORD BY 16-BIT/4,194,304-WORD BY 8-BIT) CMOS 3.3V-ONLY FLASH MEMORY & 4,194,304-BIT(262,144-WORD BY 16-BIT/524,288-WORD B

数据手册

下载地址一下载地址二到原厂下载

生产厂商

Renesas Technology Corp

简称

RENESAS瑞萨

中文名称

瑞萨科技有限公司官网

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M6MGT331S4BKT数据手册规格书PDF详情

Description

The M6MGB/T331S4BKT is a Stacked micro Multi Chip Package (S- mMCP) that contents 32M-bit Flash memory and 4M-bit Static RAM in a 52-pin TSOP for lead free use.

32M-bit Flash memory is a 4,194,304 bytes / 2,097,152 words, 3.3V-only, and high performance non-volatile memory fabricated by CMOS technology for the peripheral circuit and DINOR (Divided bit-line NOR) architecture for the memory cell.

4M-bit SRAM is a 524,288 bytes / 262,144 words asynchronous SRAM fabricated by silicon-gate CMOS technology.

M6MGB/T331S4BKT is suitable for the application of the mobile-communication-system to reduce both the mount space and weight.

M6MGB/T331S4BKT provides for Software Lock Release function. Usually, all memory blocks are locked and can not be programmed or erased, when F-WP# is low. Using Software Lock Release function, program or erase operation can be executed.

Features

Access Time Flash 70ns (Max.)

SRAM 70ns (Max.)

Supply Voltage VCC=2.7 ~ 3.0V

Ambient Temperature Ta=-40 ~ 85 °C

Package 52pin TSOP(Type-II),

Lead pitch 0.4mm

Outer-lead finishing:Sn-Cu

Application

Mobile communication products

M6MGT331S4BKT产品属性

  • 类型

    描述

  • 型号

    M6MGT331S4BKT

  • 制造商

    RENESAS

  • 制造商全称

    Renesas Technology Corp

  • 功能描述

    33,554,432-BIT(2,097,152 - WORD BY 16-BIT/4,194,304-WORD BY 8-BIT) CMOS 3.3V-ONLY FLASH MEMORY & 4,194,304-BIT(262,144-WORD BY 16-BIT/524,288-WORD B

更新时间:2025-5-28 13:01:00
供应商 型号 品牌 批号 封装 库存 备注 价格
RENESAS
23+
BGA
50000
全新原装正品现货,支持订货
RENESAS
22+
BGA
3000
原装正品,支持实单
RENESAS
03+
BGA
336
一级代理,专注军工、汽车、医疗、工业、新能源、电力
RENESAS
2023+
BGA
8800
正品渠道现货 终端可提供BOM表配单。
RENESAS
24+
BGA
336
进口原装
RENESAS
20+
BGA
336
进口原装现货,假一赔十
RENESAS
25+
BGA
8800
公司只做原装,详情请咨询
RENESAS
24+
BGA811
5
RENESAS
1725+
BGA
6528
只做原装正品现货!或订货假一赔十!
RENESAS
BGA811
68500
一级代理 原装正品假一罚十价格优势长期供货

RENESAS相关电路图

  • RESI
  • RESONAC
  • REYCONNS
  • RF
  • RFBEAM
  • RFE
  • RFHIC
  • rfm
  • RFMD
  • RFSOLUTIONS
  • RFX
  • RHOMBUS-IND

Renesas Technology Corp 瑞萨科技有限公司

中文资料: 114135条

瑞萨科技公司(Renesas Technology Corp.)是一家全球领先的半导体解决方案供应商,总部位于日本东京。公司成立于2002年,由原日立半导体和三菱电机半导体合并而成,专注于提供高性能和高效能的微控制器、模拟和混合信号IC、功率半导体以及系统集成解决方案,广泛应用于汽车、工业控制、信息通信、消费电子等多个领域。瑞萨科技的产品组合涵盖微控制器(MCUs)、模拟和混合信号IC、功率半导体以及汽车解决方案等。公司在汽车电子领域具有强大的技术实力,提供车载MCU、传感器和网络解决方案,支持智能汽车的发展。瑞萨在全球设有多个研发中心和分支机构,产品及解决方案销售至欧美、亚洲等地区,致力于为