位置:HD64F2633TE25 > HD64F2633TE25详情

HD64F2633TE25中文资料

厂家型号

HD64F2633TE25

文件大小

5590.57Kbytes

页面数量

1453

功能描述

Series of Microcomputers (MCUs: microcomputer units)

H8S 25MHz Cut Tape

数据手册

下载地址一下载地址二到原厂下载

生产厂商

Renesas Technology Corp

简称

RENESAS瑞萨

中文名称

瑞萨科技有限公司官网

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HD64F2633TE25数据手册规格书PDF详情

Overview

The H8S/2633 Group is a series of microcomputers (MCUs: microcomputer units), built around the H8S/2600 CPU, employing Renesas’ proprietary architecture, and equipped with peripheral functions on-chip.

The H8S/2600 CPU has an internal 32-bit architecture, is provided with sixteen 16-bit general registers and a concise, optimized instruction set designed for high-speed operation, and can address a 16-Mbyte linear address space. The instruction set is upward-compatible with H8/300 and H8/300H CPU instructions at the object-code level, facilitating migration from the H8/300, H8/300L, or H8/300H Series.

On-chip peripheral functions required for system configuration include DMA controller (DMAC)*2, data transfer controller (DTC)*2 bus masters, ROM and RAM memory, a 16-bit timer-pulse unit (TPU), programmable pulse generator (PPG)*2, 8-bit timer*2, 14-bit PWM timer (PWM)*2, watchdog timer (WDT), serial communication interface (SCI, IrDA*2), A/D converter, D/A converter*2, and I/O ports. It is also possible to incorporate an on-chip PC bus interface (IIC)*2 as an option.

On-chip ROM is available as 256-kbyte flash memory (F-ZTAT™ version)*1 or as 256-, 128-, or 64-kbyte mask ROM. ROM is connected to the CPU via a 16-bit data bus, enabling both byte and word data to be accessed in one state. Instruction fetching has been speeded up, and processing speed increased.

Four operating modes, modes 4 to 7, are provided, and there is a choice of single-chip mode or external expansion mode.

The features of the H8S/2633 Group are shown in table 1.1.

HD64F2633TE25产品属性

  • 类型

    描述

  • 型号

    HD64F2633TE25

  • 制造商

    Renesas Electronics

  • 功能描述

    H8S 25MHz Cut Tape

更新时间:2025-5-18 10:00:00
供应商 型号 品牌 批号 封装 库存 备注 价格
Renesas(瑞萨)
24+
标准封装
7161
支持大陆交货,美金交易。原装现货库存。
RENESAS
2014+
1
公司现货库存
RENESAS
23+
65480
RENESAS
16+
QFP
8800
进口原装大量现货热卖中
RENESAS
24+
QFP
3000
进口原装正品优势供应
RENESAS
20+
QFP
35830
原装优势主营型号-可开原型号增税票
RENESAS
2023+
QFP
9330
专注配单,只做原装进口现货
RENESAS
23+
QFP
8000
只做原装现货
RENESAS
23+
QFP
7000
RENESAS
2023+
QFP
5800
进口原装,现货热卖

RENESAS相关电路图

  • RESI
  • RESONAC
  • REYCONNS
  • RF
  • RFBEAM
  • RFE
  • RFHIC
  • rfm
  • RFMD
  • RFSOLUTIONS
  • RFX
  • RHOMBUS-IND

Renesas Technology Corp 瑞萨科技有限公司

中文资料: 113842条

瑞萨科技公司(Renesas Technology Corp.)是一家全球领先的半导体解决方案供应商,总部位于日本东京。公司成立于2002年,由原日立半导体和三菱电机半导体合并而成,专注于提供高性能和高效能的微控制器、模拟和混合信号IC、功率半导体以及系统集成解决方案,广泛应用于汽车、工业控制、信息通信、消费电子等多个领域。瑞萨科技的产品组合涵盖微控制器(MCUs)、模拟和混合信号IC、功率半导体以及汽车解决方案等。公司在汽车电子领域具有强大的技术实力,提供车载MCU、传感器和网络解决方案,支持智能汽车的发展。瑞萨在全球设有多个研发中心和分支机构,产品及解决方案销售至欧美、亚洲等地区,致力于为