位置:RS95848R > RS95848R详情

RS95848R中文资料

厂家型号

RS95848R

文件大小

382.31Kbytes

页面数量

7

功能描述

2.5V to 7.5V, 80A, High-Efficiency Half-Bridge Power-stage with Current and Temperature Sense in 4x5mm Package

数据手册

下载地址一下载地址二到原厂下载

生产厂商

Reed Semiconductor Corp.

简称

REED

中文名称

官网

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RS95848R数据手册规格书PDF详情

Features

• 2.5V to 7.5V Operating Input Range

• 3.3V VDD supply for internal logic

• Integrated power stage with High/Low-side

MOSFETs and Drivers

• 80A Max, 40A TDC Output Current

• Operation Frequency up to 3MHz with 5V VIN

• Compatible with 3.3V tri-state PWM input

• Internal Current Sense and Temperature Sense

• Built in Protection

- Vin and VDD/VDRV UVLO

- High side Over Current Protection

- Cycle-by-cycle Over Current Limit

- Over Temperature Protection (OTP)

• Common Footprint Small Package Size 4x5mm

• RoHS Compliant and Green

Applications

• Server and Telecom Voltage Regulators

• Graphic Card Core Regulators

• Power Module

Description

The RS95848 is a compact TLGA device measuring

4mm x 5mm, designed for use in Server and Telecom

applications that require high efficiency and small size.

It is a monolithic half-bridge that includes internal

power MOSFETs and gate drivers, enabling it to

achieve a continuous output current of 40A over a

wide input supply range of 2.5V to 7.5V. The

integration of driver and MOSFETs ensures high

efficiency by reducing parasitic inductance and

optimizing dead time.

This device can operate from 100kHz to 3MHz with a

5V input voltage. It is compatible with tri-state output

controllers and includes a general-purpose current

sense and temperature sense, meeting industry

specifications.

更新时间:2025-5-1 13:26:00
供应商 型号 品牌 批号 封装 库存 备注 价格
SXSEMI
24+
DFN1006
900000
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1000
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RS PRO
22+
288000
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KRS
23+
QFP44
3000
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NEC
2447
QFP
100500
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QFP
4500
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85600
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QFP
50000
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NA/
450
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NEC
24+
QFP
60000

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Reed Semiconductor Corp.

中文资料: 348条

Reed Semiconductor成立于2019年,由一支半导体设计和封装专家团队创立,专注于开发创新解决方案以应对最具挑战性的电源管理问题。Reed这个名字代表了我们对提供稳健、高效、环保与高密度电源解决方案的承诺,旨在优化电源传输、节约能源,并降低解决方案的体积和成本。 公司总部位于美国罗德岛州,并在台北和班加罗尔设有办事处。Reed作为一家无晶圆厂半导体公司,与全球顶级晶圆代工厂和组装合作伙伴紧密合作。 随着人工智能(AI)和高性能计算(HPC)不断提升电源需求,数据中心面临着管理动态负载同时最小化能量损失的挑战。Reed的创新解决方案正是为了解决这些挑战。而我们的汽车、电信和工业客户