位置:RS31311BR > RS31311BR详情

RS31311BR中文资料

厂家型号

RS31311BR

文件大小

409.9Kbytes

页面数量

8

功能描述

Simple 3.3V/5V/12V 4A eFuse Protection Switches

数据手册

下载地址一下载地址二到原厂下载

生产厂商

Reed Semiconductor Corp.

简称

REED

中文名称

官网

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RS31311BR数据手册规格书PDF详情

Features

• RS31211 - 3.3V eFuse

• RS31212 - 5V eFuse

• RS31309 – 2.97V to 18V input

• RS31311 - 12V eFuse

• Integrated 34mΩ Pass MOSFET

• Adjustable 0.5A to 4A current limit

• Adjustable output slew rate

• Enable with adjustable input UVLO threshold

• Fixed over-voltage camp: 3.8V for RS31211,

5.7V for RS31212 and 13.7V for RS31311

• Built-on over temperature protection

• Small 2x2mm WSON package

• RoHS compliant and Green

Applications

• Hot-swap, hot-plug

• PCI and PCIe cards

• Adapter powered devices

• HDD and SSD drivers

Description

The RS31211/212/309/311 devices are active

circuit protection devices with an integrated

MOSFET used to limit current and voltage to safe

levels during fault conditions.

The current limit level can be set with a resistor

between ILM and ground, and the typical current

limit accuracy is ±7.5%.

The device has over voltage protection feature

which limits the output voltage to a fixed level when

over voltage fault occurs.

To limit the inrush current during device turn-on, the

rising slew rate of output voltage can be set by a

capacitor between dVdt and ground.

The device also offers EN on/off control and input

UVLO features.

The device is available in WSON 8 pins, 2x2 mm

package.

更新时间:2025-5-1 15:38:00
供应商 型号 品牌 批号 封装 库存 备注 价格
Reed Semiconductor Corp
23+/24+
8-DFN
8600
只供原装进口公司现货+可订货
24+
N/A
56000
一级代理-主营优势-实惠价格-不悔选择
RECOM
1208+
SIP/DIP
870
稳压隔离模块专家供应商/绝对全新原厂现货
RECOM
23+
SIP
11200
原厂授权一级代理、全球订货优势渠道、可提供一站式BO
RECOM
2021+
SIP
11000
十年专营原装现货,假一赔十

REED相关电路图

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  • RENATA
  • RENCO
  • RENESAS
  • RESI
  • RESONAC
  • REYCONNS
  • RF
  • RFBEAM
  • RFE

Reed Semiconductor Corp.

中文资料: 348条

Reed Semiconductor成立于2019年,由一支半导体设计和封装专家团队创立,专注于开发创新解决方案以应对最具挑战性的电源管理问题。Reed这个名字代表了我们对提供稳健、高效、环保与高密度电源解决方案的承诺,旨在优化电源传输、节约能源,并降低解决方案的体积和成本。 公司总部位于美国罗德岛州,并在台北和班加罗尔设有办事处。Reed作为一家无晶圆厂半导体公司,与全球顶级晶圆代工厂和组装合作伙伴紧密合作。 随着人工智能(AI)和高性能计算(HPC)不断提升电源需求,数据中心面临着管理动态负载同时最小化能量损失的挑战。Reed的创新解决方案正是为了解决这些挑战。而我们的汽车、电信和工业客户