位置:RS31230R > RS31230R详情

RS31230R中文资料

厂家型号

RS31230R

文件大小

216.95Kbytes

页面数量

5

功能描述

Dual Efuses with Bi-Directional Current Support

数据手册

下载地址一下载地址二到原厂下载

生产厂商

Reed Semiconductor Corp.

简称

REED

中文名称

官网

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RS31230R数据手册规格书PDF详情

Features

• Integrated dual eFuses with bi-directional

current support

• Operating input range: 1.5V to 5V

• 100mA continuous current for each channel

• Low Ron resistance: 2Ω

• Low operating quiescent current: 2.2uA

• Low shutdown current: 0.65uA

• Two control pins for switch open/close control

• Fixed 150mA OCP protection with auto-retry

feature

• Input OVP protection

• Over temperature protection

• Small 0.74x1.42mm WLCSP package

• RoHS compliant and Green

Applications

• Multiple efuses application

• Battery charge management

• Surveillance system

• Telematics

Descriptions

The RS31230 is a highly integrated dual efuse

specifically designed for the applications requiring

over-current protection, hot swap operation and inrush

current control.

With its bi-directional current support capability, the

device permits current flow in both directions: either

from ChxA to ChxB or vice vera.

Furthermore, the device is equipped with fixed

150mA bi-directional over-current protection that

comes with auto-retry feature.

Moreover, the device features two control pins that

allow for external control of both channels, enabling

opening and closing upon demand.

In addition, the device includes VDD over-voltage

protection and over-temperature protection.

The device is available in WLCSP 8 pins, 0.74x1.42

mm package.

更新时间:2025-5-1 15:38:00
供应商 型号 品牌 批号 封装 库存 备注 价格
Reed Semiconductor Corp
23+/24+
8-DFN
8600
只供原装进口公司现货+可订货
PLAIMAE/HAMPOLT
23+
11200
原厂授权一级代理、全球订货优势渠道、可提供一站式BO
RECOM
1208+
SIP/DIP
870
稳压隔离模块专家供应商/绝对全新原厂现货
RECOM
2021+
SIP
11000
十年专营原装现货,假一赔十
24+
N/A
60000
一级代理-主营优势-实惠价格-不悔选择

REED相关电路图

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  • RFBEAM
  • RFE

Reed Semiconductor Corp.

中文资料: 348条

Reed Semiconductor成立于2019年,由一支半导体设计和封装专家团队创立,专注于开发创新解决方案以应对最具挑战性的电源管理问题。Reed这个名字代表了我们对提供稳健、高效、环保与高密度电源解决方案的承诺,旨在优化电源传输、节约能源,并降低解决方案的体积和成本。 公司总部位于美国罗德岛州,并在台北和班加罗尔设有办事处。Reed作为一家无晶圆厂半导体公司,与全球顶级晶圆代工厂和组装合作伙伴紧密合作。 随着人工智能(AI)和高性能计算(HPC)不断提升电源需求,数据中心面临着管理动态负载同时最小化能量损失的挑战。Reed的创新解决方案正是为了解决这些挑战。而我们的汽车、电信和工业客户