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UMB8F中文资料
UMB8F数据手册规格书PDF详情
Features
* Low profile space
* Ideal for automated placement
* Glass passivated chip junction
* Low forward voltage drop
* Low leakage current
* High forward surge capability
* High temperature soldering:
260℃/10 seconds at terminals
* Component in accordance to
RoHS 2002/95/1 and WEEE 2002/96/EC
更新时间:2025-5-15 11:13:00
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
MDD |
21+ |
MBF |
12588 |
原装正品,价格优势 |
|||
PRISEMI/芯导 |
24+ |
SOF2-4 |
900000 |
原装进口特价 |
|||
24+ |
N/A |
52000 |
一级代理-主营优势-实惠价格-不悔选择 |
||||
NS/国半 |
23+ |
MSOP8 |
69820 |
终端可以免费供样,支持BOM配单! |
|||
JINGDAO/晶导微 |
23+ |
MBF |
5000 |
原装现货 |
|||
CJ/长电 |
24+ |
ABF |
50000 |
只做原装,欢迎询价,量大价优 |
|||
ZV |
23+ |
MBM |
11200 |
原厂授权一级代理、全球订货优势渠道、可提供一站式BO |
|||
ROHM |
24+ |
SOT-363/SOT-323-6 |
15200 |
新进库存/原装 |
|||
ROHM |
23+ |
SOT323-6 |
31000 |
全新原装现货 |
|||
SOT-363 |
23+ |
NA |
15659 |
振宏微专业只做正品,假一罚百! |
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